Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051457/0679 | |
| Pages: | 7 |
| | Recorded: | 01/01/2020 | | |
| Attorney Dkt #: | YOR920030192US1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED ON REEL 014618 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10686640
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Filing Dt:
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10/17/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Title:
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SILICON CHIP CARRIER WITH THROUGH-VIAS USING LASER ASSISTED CHEMICAL VAPOR DEPOSITION OF CONDUCTOR
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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1101 KITCHAWAN ROAD, ROUTE 134, P.O. BOX 218
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YORKTOWN, NY 10598
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