Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051501/0602 | |
| Pages: | 4 |
| | Recorded: | 01/14/2020 | | |
| Attorney Dkt #: | VISP0033USA |
| Conveyance: | LICENSE (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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13052134
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Filing Dt:
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03/21/2011
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Publication #:
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Pub Dt:
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09/27/2012
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Title:
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PACKAGE INTERCONNECTS
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Patent #:
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Issue Dt:
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09/12/2017
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Application #:
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14660949
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Filing Dt:
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03/18/2015
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Publication #:
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Pub Dt:
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09/22/2016
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Title:
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EDGE STRUCTURE FOR BACKGRINDING ASYMMETRICAL BONDED WAFER
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14868645
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Filing Dt:
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09/29/2015
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Publication #:
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Pub Dt:
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03/30/2017
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Title:
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INTEGRATED CIRCUITS WITH ALIGNMENT MARKS AND METHODS OF PRODUCING THE SAME
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Assignee
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| 1 TAMPINES INDUSTRIAL AVENUE 5 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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