Patent Assignment Details
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Reel/Frame: | 051503/0837 | |
| Pages: | 3 |
| | Recorded: | 01/14/2020 | | |
Attorney Dkt #: | 194411US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16682554
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Filing Dt:
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11/13/2019
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Publication #:
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Pub Dt:
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05/13/2021
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Title:
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DIE-TO-WAFER HYBRID BONDING WITH FORMING GLASS
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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PATTERSON & SHERIDAN, L.L.P. QUALCOMM
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24 GREENWAY PLAZA, SUITE 1600
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HOUSTON, TX 77046
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05/13/2024 06:40 AM
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