Patent Assignment Details
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| Reel/Frame: | 051539/0468 | |
| Pages: | 4 |
| | Recorded: | 01/16/2020 | | |
| Attorney Dkt #: | JP920170024US03(M1819D) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16744996
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Filing Dt:
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01/16/2020
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Title:
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FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BUMP AND INJECTION MOLDED SOLDER, AND FLIP CHIP JOINING WITH THE SOLDER BUMP
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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TUTUNJIAN & BITETTO, P.C.
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401 BROADHOLLOW ROAD
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SUITE 402
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MELVILLE, NY 11747
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04/29/2024 08:58 PM
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