Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051604/0824 | |
| Pages: | 3 |
| | Recorded: | 01/24/2020 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13249196
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Filing Dt:
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09/29/2011
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Publication #:
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Pub Dt:
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04/04/2013
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Title:
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LIGHT EMITTING DEVICES HAVING LIGHT COUPLING LAYERS WITH RECESSED ELECTRODES
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Patent #:
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Issue Dt:
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07/14/2015
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Application #:
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13754517
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Filing Dt:
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01/30/2013
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Publication #:
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Pub Dt:
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05/07/2015
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Title:
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GaN Based LED Having Reduced Thickness and Method for Making the Same
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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14256715
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Filing Dt:
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04/18/2014
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Publication #:
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Pub Dt:
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10/22/2015
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Title:
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High Efficiency Light Emitting Diode Package Suitable for Wafer Level Packaging
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Patent #:
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Issue Dt:
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04/26/2016
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Application #:
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14659029
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Filing Dt:
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03/16/2015
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Title:
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CHIP-ON-HEATSINK LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU, |
| TOKYO,, JAPAN |
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Correspondence name and address
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CPA GLOBAL LIMITED
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LIBERATION HOUSE
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CASTLE STREET
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ST HELIER, JEI IBL JERSEY
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