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Reel/Frame:051648/0065   Pages: 4
Recorded: 01/28/2020
Attorney Dkt #:095714-0586
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/24/2021
Application #:
16542087
Filing Dt:
08/15/2019
Publication #:
Pub Dt:
05/07/2020
Title:
WAFER-TO-DESIGN IMAGE ANALYSIS (WDIA) SYSTEM
Assignors
1
Exec Dt:
08/16/2019
2
Exec Dt:
08/16/2019
Assignee
1
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITAL STREET, N.W.
WASHINGTON, DC 20001

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