Patent Assignment Details
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| Reel/Frame: | 051666/0830 | |
| Pages: | 7 |
| | Recorded: | 01/22/2020 | | |
| Attorney Dkt #: | 16519D1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE INTERNAL ADDRESS PREVIOUSLY RECORDED AT REEL: 051304 FRAME: 0248. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2022
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Application #:
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16413356
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Filing Dt:
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05/15/2019
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Publication #:
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Pub Dt:
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08/29/2019
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Title:
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METHOD OF MANUFACTURING BONDED SUBSTRATE
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Assignee
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036
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