|
Total properties:
21
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2008
|
Application #:
|
11510870
|
Filing Dt:
|
08/24/2006
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2007
| | | | |
|
Title:
|
PHOTODETECTING DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/13/2010
|
Application #:
|
12183538
|
Filing Dt:
|
07/31/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/11/2008
| | | | |
|
Title:
|
PHOTODETECTING DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2013
|
Application #:
|
12897491
|
Filing Dt:
|
10/04/2010
|
|
Publication #:
|
|
Pub Dt:
|
01/12/2012
| | | | |
|
Title:
|
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2013
|
Application #:
|
12910023
|
Filing Dt:
|
10/22/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
|
Title:
|
PROCESS FOR MEASURING AN ADHESION ENERGY, AND ASSOCIATED SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2014
|
Application #:
|
12970422
|
Filing Dt:
|
12/16/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/21/2012
| | | | |
|
Title:
|
METHODS FOR DIRECTLY BONDING TOGETHER SEMICONDUCTOR STRUCTURES, AND BONDED SEMICONDUCTOR STRUCTURES FORMED USING SUCH METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2014
|
Application #:
|
13076745
|
Filing Dt:
|
03/31/2011
|
|
Publication #:
|
|
Pub Dt:
|
10/04/2012
| | | | |
|
Title:
|
METHODS FOR BONDING SEMICONDUCTOR STRUCTURES INVOLVING ANNEALING PROCESSES, AND BONDED SEMICONDUCTOR STRUCTURES AND INTERMEDIATE STRUCTURES FORMED USING SUCH METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
13077364
|
Filing Dt:
|
03/31/2011
|
|
Publication #:
|
|
Pub Dt:
|
10/04/2012
| | | | |
|
Title:
|
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEMICONDUCTOR STRUCTURES CARRIED BY A COMMON SUBSTRATE, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2012
|
Application #:
|
13123661
|
Filing Dt:
|
04/11/2011
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2011
| | | | |
|
Title:
|
METHOD OF FABRICATING A BACK-ILLUMINATED IMAGE SENSOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2014
|
Application #:
|
13185044
|
Filing Dt:
|
07/18/2011
|
|
Publication #:
|
|
Pub Dt:
|
01/24/2013
| | | | |
|
Title:
|
BONDING SURFACES FOR DIRECT BONDING OF SEMICONDUCTOR STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13206242
|
Filing Dt:
|
08/09/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/14/2013
| | | | |
|
Title:
|
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING INTERCONNECT LAYERS HAVING ONE OR MORE OF ELECTRICAL, OPTICAL, AND FLUIDIC INTERCONNECTS THEREIN, AND BONDED SEMICONDUCTOR STRUCTURES FORMED USING SUCH METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
|
13206280
|
Filing Dt:
|
08/09/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/14/2013
| | | | |
|
Title:
|
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATION PROCESSES USING RECOVERABLE SUBSTRATES, AND BONDED SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2014
|
Application #:
|
13206299
|
Filing Dt:
|
08/09/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/14/2013
| | | | |
|
Title:
|
METHODS OF FORMING THREE DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS INCLUDING PHOTOACTIVE DEVICES AND SEMICONDUCTOR-ON-INSULATOR SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
13219099
|
Filing Dt:
|
08/26/2011
|
|
Publication #:
|
|
Pub Dt:
|
04/19/2012
| | | | |
|
Title:
|
PROCESS FOR REALIZING A CONNECTING STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/13/2015
|
Application #:
|
13255670
|
Filing Dt:
|
10/18/2011
|
|
Publication #:
|
|
Pub Dt:
|
02/02/2012
| | | | |
|
Title:
|
METHOD OF FABRICATING A MULTILAYER STRUCTURE WITH CIRCUIT LAYER TRANSFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2015
|
Application #:
|
13536034
|
Filing Dt:
|
06/28/2012
|
|
Publication #:
|
|
Pub Dt:
|
01/02/2014
| | | | |
|
Title:
|
SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLING AND RELATED METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2016
|
Application #:
|
13536061
|
Filing Dt:
|
06/28/2012
|
|
Publication #:
|
|
Pub Dt:
|
01/02/2014
| | | | |
|
Title:
|
INTERPOSERS INCLUDING FLUIDIC MICROCHANNELS AND RELATED STRUCTURES AND METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/22/2015
|
Application #:
|
13624470
|
Filing Dt:
|
09/21/2012
|
|
Publication #:
|
|
Pub Dt:
|
02/07/2013
| | | | |
|
Title:
|
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/28/2014
|
Application #:
|
13657327
|
Filing Dt:
|
10/22/2012
|
|
Publication #:
|
|
Pub Dt:
|
02/21/2013
| | | | |
|
Title:
|
BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEMICONDUCTOR STRUCTURES CARRIED BY A COMMON SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2015
|
Application #:
|
13838031
|
Filing Dt:
|
03/15/2013
|
|
Publication #:
|
|
Pub Dt:
|
08/15/2013
| | | | |
|
Title:
|
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2016
|
Application #:
|
14474503
|
Filing Dt:
|
09/02/2014
|
|
Publication #:
|
|
Pub Dt:
|
12/18/2014
| | | | |
|
Title:
|
METHODS OF FORMING THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS INCLUDING PHOTOACTIVE DEVICES AND SEMICONDUCTOR-ON-INSULATOR SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/2016
|
Application #:
|
14642196
|
Filing Dt:
|
03/09/2015
|
|
Publication #:
|
|
Pub Dt:
|
06/25/2015
| | | | |
|
Title:
|
SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLING AND RELATED METHODS
|
|
