Patent Assignment Details
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| Reel/Frame: | 051821/0991 | |
| Pages: | 7 |
| | Recorded: | 02/14/2020 | | |
| Attorney Dkt #: | 20151393/24061.3344US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16687152
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Filing Dt:
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11/18/2019
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Publication #:
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Pub Dt:
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03/12/2020
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Title:
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METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE, LLP IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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