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Reel/Frame:051846/0520   Pages: 5
Recorded: 02/18/2020
Attorney Dkt #:1012-2652 / 2019P56026 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/07/2022
Application #:
16774800
Filing Dt:
01/28/2020
Publication #:
Pub Dt:
07/29/2021
Title:
Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control
Assignors
1
Exec Dt:
01/30/2020
2
Exec Dt:
01/31/2020
3
Exec Dt:
02/03/2020
4
Exec Dt:
01/31/2020
5
Exec Dt:
01/30/2020
6
Exec Dt:
01/30/2020
7
Exec Dt:
01/31/2020
Assignee
1
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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