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Reel/Frame:051922/0915   Pages: 4
Recorded: 02/25/2020
Attorney Dkt #:2020-0361A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
11624120
Issue Dt:
04/11/2023
Application #:
16641869
Filing Dt:
02/25/2020
Publication #:
US20200224324
Pub Dt:
07/16/2020
Title:
ADDITIVE FOR ELECTROLYTIC PLATING SOLUTIONS, ELECTROLYTIC PLATING SOLUTION CONTAINING ADDITIVE FOR ELECTROLYTIC PLATING SOLUTIONS, AND ELECTROLYTIC PLATING METHOD USING ELECTROLYTIC PLATING SOLUTION
Assignors
1
TANAKA, SHINICHI
Exec Dt:
02/06/2020
2
TOYODA, SHOUHEI
Exec Dt:
02/07/2020
3
ISHIWATA, SHINYA
Exec Dt:
02/06/2020
4
TAKAHASHI, TAKUYA
Exec Dt:
02/06/2020
5
KIM, YONG GYUN
Exec Dt:
02/05/2020
Assignee
1
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU
TOKYO, JAPAN 1168554
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
1025 CONNECTICUT AVENUE NW
SUITE 500
WASHINGTON, DC 20036

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