Patent Assignment Details
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| Reel/Frame: | 051952/0047 | |
| Pages: | 4 |
| | Recorded: | 02/27/2020 | | |
| Attorney Dkt #: | TTAP 9912 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16642288
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Filing Dt:
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02/26/2020
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Publication #:
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Pub Dt:
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12/03/2020
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Title:
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SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT
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Assignee
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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BRIAN S. MYERS
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100 HEADQUARTERS PLAZA
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WEST TOWER, 7TH FLOOR
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MORRISTOWN, NJ 07960-6834
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