Patent Assignment Details
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| Reel/Frame: | 052032/0506 | |
| Pages: | 53 |
| | Recorded: | 10/01/2019 | | |
| Attorney Dkt #: | 1385.001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12160553
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Filing Dt:
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07/10/2008
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE WITH AN INTERMETALLIC COMPOUND REGION COUPLING A SOLDER MASS TO AN NI LAYER WHICH HAS A LOW CONCENTRATION OF P, WHEREIN THE AMOUNT OF P IN THE UNDERLYING NI LAYER IS CONTROLLED AS A FUN
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Assignee
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| 401 N. MICHIGAN AVE. |
| CHICAGO, ILLINOIS 60611 |
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Correspondence name and address
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STEVE MENDELSOHN
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1500 JOHN F. KENNEDY BLVD.
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SUITE 312
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PHILADELPHIA, PA 19102
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