Patent Assignment Details
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| Reel/Frame: | 052106/0560 | |
| Pages: | 10 |
| | Recorded: | 03/13/2020 | | |
| Attorney Dkt #: | 20370-148948-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16817894
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Filing Dt:
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03/13/2020
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Publication #:
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Pub Dt:
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07/09/2020
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Title:
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COMPLEX OF LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, DELAMINATED LAMELLAR INORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED PRODUCT, AND HEAT DISSIPATING MEMBER
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Assignees
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, |
| TOKYO, JAPAN 100-6606 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8921 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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