Patent Assignment Details
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| Reel/Frame: | 052152/0354 | |
| Pages: | 4 |
| | Recorded: | 03/18/2020 | | |
| Attorney Dkt #: | 2519-0526PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2023
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Application #:
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16800220
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Filing Dt:
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02/25/2020
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Publication #:
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Pub Dt:
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08/26/2021
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE
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Assignee
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| NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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