Patent Assignment Details
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Reel/Frame: | 052180/0834 | |
| Pages: | 6 |
| | Recorded: | 03/20/2020 | | |
Attorney Dkt #: | Q253766 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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16649472
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Filing Dt:
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03/20/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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MOLDING METHOD AND MOLDING APPARATUS OF MOLDED ARTICLE COMPRISING FIBER-REINFORCED THERMOPLASTIC RESIN
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Assignee
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11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
TOKYO, JAPAN 1410032 |
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Correspondence name and address
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SUGHRUE MION, PLLC.
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2000 PENNSYLVANIA AVE., NW.
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8TH FLOOR
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WASHINGTON, DC 20006
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