Patent Assignment Details
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| Reel/Frame: | 052284/0210 | |
| Pages: | 5 |
| | Recorded: | 04/01/2020 | | |
| Attorney Dkt #: | 44017132US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16731365
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Filing Dt:
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12/31/2019
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Publication #:
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Pub Dt:
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07/01/2021
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Title:
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METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
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Assignee
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| 8 UPPER CHANGI ROAD NORTH |
| APPLIED MATERIALS BUILDING |
| SINGAPORE, SINGAPORE 506906 |
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Correspondence name and address
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MOSER TABOADA/ALAN TABOADA
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1030 BROAD STREET
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SUITE 203
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SHREWSBURY, NJ 07702
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05/11/2024 08:39 PM
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