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Reel/Frame:052290/0727   Pages: 26
Recorded: 04/01/2020
Attorney Dkt #:1012-2257 / 2017P50933 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
10734352
Issue Dt:
08/04/2020
Application #:
16148316
Filing Dt:
10/01/2018
Publication #:
US20190103378
Pub Dt:
04/04/2019
Title:
Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement
Assignors
1
ESCHER-POEPPEL, IRMGARD
Exec Dt:
10/02/2018
2
HOSSEINI, KHALIL
Exec Dt:
10/19/2018
3
LODERMEYER, JOHANNES
Exec Dt:
10/05/2018
4
MAHLER, JOACHIM
Exec Dt:
10/16/2018
5
MEYER, THORSTEN
Exec Dt:
10/02/2018
6
MEYER-BERG, GEORG
Exec Dt:
10/02/2018
7
NIKITIN, IVAN
Exec Dt:
10/31/2018
8
PUFALL, REINHARD
Exec Dt:
03/31/2020
9
RIEDL, EDMUND
Exec Dt:
10/08/2018
10
SCHMIDT, KLAUS
Exec Dt:
10/29/2018
11
SCHNEEGANS, MANFRED
Exec Dt:
10/11/2018
12
SCHWARZ, PATRICK
Exec Dt:
10/31/2018
Assignee
1
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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