Patent Assignment Details
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Reel/Frame: | 052338/0623 | |
| Pages: | 8 |
| | Recorded: | 04/08/2020 | | |
Attorney Dkt #: | USCP10745C/NB6896-SYO |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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16842784
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Filing Dt:
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04/08/2020
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Publication #:
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Pub Dt:
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10/22/2020
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Title:
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Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
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Assignee
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66-68, SHUNYU ROAD, YUYAO, |
NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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DAVID AND RAYMOND PATENT FIRM
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108 N. YNEZ AVE., SUITE 128
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MONTEREY PARK, CA 91754
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05/02/2024 05:53 PM
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