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Total properties:
18
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|
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Patent #:
|
|
Issue Dt:
|
05/17/2011
|
Application #:
|
11649203
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Filing Dt:
|
01/04/2007
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|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
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Title:
|
PROCESS FOR PRODUCING MULTILAYER BOARD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
11806680
|
Filing Dt:
|
06/01/2007
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|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
|
Title:
|
BUILDUP BOARD, AND ELECTRONIC COMPONENT AND APPARATUS HAVING THE BUILDUP BOARD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2012
|
Application #:
|
12175732
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Filing Dt:
|
07/18/2008
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|
Publication #:
|
|
Pub Dt:
|
04/16/2009
| | | | |
|
Title:
|
METHOD OF PRODUCING SUBSTRATE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2012
|
Application #:
|
12365279
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Filing Dt:
|
02/04/2009
|
|
Publication #:
|
|
Pub Dt:
|
12/03/2009
| | | | |
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Title:
|
METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/21/2012
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Application #:
|
12390010
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Filing Dt:
|
02/20/2009
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|
Publication #:
|
|
Pub Dt:
|
12/03/2009
| | | | |
|
Title:
|
CORE SUBSTRATE AND PRINTED WIRING BOARD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
12929680
|
Filing Dt:
|
02/08/2011
|
|
Publication #:
|
|
Pub Dt:
|
03/22/2012
| | | | |
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Title:
|
PACKAGE SUBSTRATE UNIT AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE UNIT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2014
|
Application #:
|
13074442
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Filing Dt:
|
03/29/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2011
| | | | |
|
Title:
|
LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2013
|
Application #:
|
13085804
|
Filing Dt:
|
04/13/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2011
| | | | |
|
Title:
|
LAMINATED CIRCUIT BOARD AND BOARD PRODUCING METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
13629660
|
Filing Dt:
|
09/28/2012
|
|
Publication #:
|
|
Pub Dt:
|
04/25/2013
| | | | |
|
Title:
|
WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2017
|
Application #:
|
14300360
|
Filing Dt:
|
06/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
01/29/2015
| | | | |
|
Title:
|
PRODUCTION METHOD OF CIRCUIT BOARD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2019
|
Application #:
|
15677771
|
Filing Dt:
|
08/15/2017
|
|
Publication #:
|
|
Pub Dt:
|
11/30/2017
| | | | |
|
Title:
|
CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
|
Application #:
|
15806385
|
Filing Dt:
|
11/08/2017
|
|
Publication #:
|
|
Pub Dt:
|
06/07/2018
| | | | |
|
Title:
|
METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2019
|
Application #:
|
15956829
|
Filing Dt:
|
04/19/2018
|
|
Publication #:
|
|
Pub Dt:
|
11/01/2018
| | | | |
|
Title:
|
METHOD OF MANUFACTURING BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/2020
|
Application #:
|
16124730
|
Filing Dt:
|
09/07/2018
|
|
Publication #:
|
|
Pub Dt:
|
01/10/2019
| | | | |
|
Title:
|
WIRING BOARD, ELECTRONIC DEVICE, AND WIRING BOARD MANUFACTURING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2022
|
Application #:
|
16162470
|
Filing Dt:
|
10/17/2018
|
|
Publication #:
|
|
Pub Dt:
|
02/14/2019
| | | | |
|
Title:
|
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16297962
|
Filing Dt:
|
03/11/2019
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2019
| | | | |
|
Title:
|
WIRING SUBSTRATE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR WIRING SUBSTRATE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2021
|
Application #:
|
16430735
|
Filing Dt:
|
06/04/2019
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2019
| | | | |
|
Title:
|
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2021
|
Application #:
|
16662440
|
Filing Dt:
|
10/24/2019
|
|
Title:
|
MULTILAYER SUBSTRATE
|
|
