Patent Assignment Details
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| Reel/Frame: | 052374/0092 | |
| Pages: | 3 |
| | Recorded: | 04/12/2020 | | |
| Attorney Dkt #: | 157928.189853 (80889) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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16633452
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Filing Dt:
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04/11/2020
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Publication #:
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Pub Dt:
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07/30/2020
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Title:
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THERMALLY-CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE
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Assignee
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| 2-24, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 1408617 |
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Correspondence name and address
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WARNER NORCROSS + JUDD LLP INTELLECTUAL
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1500 WARNER BUILDING
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150 OTTAWA AVE NW
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GRAND RAPIDS, MI 49503-2487
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05/10/2024 01:33 AM
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