Patent Assignment Details
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| Reel/Frame: | 052405/0237 | |
| Pages: | 4 |
| | Recorded: | 04/15/2020 | | |
| Attorney Dkt #: | 1420149.727US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/04/2021
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Application #:
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16756275
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Filing Dt:
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04/15/2020
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Publication #:
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Pub Dt:
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10/08/2020
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Title:
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BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
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Assignee
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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05/15/2024 08:23 AM
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