Patent Assignment Details
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| Reel/Frame: | 052412/0079 | |
| Pages: | 5 |
| | Recorded: | 04/16/2020 | | |
| Attorney Dkt #: | 191475 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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16850099
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Filing Dt:
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04/16/2020
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Publication #:
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Pub Dt:
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10/22/2020
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Title:
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MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM
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Assignee
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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AARON L. WEBB
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OLIFF PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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04/28/2024 02:44 PM
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