Patent Assignment Details
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| Reel/Frame: | 052424/0332 | |
| Pages: | 11 |
| | Recorded: | 04/17/2020 | | |
| Attorney Dkt #: | 20370-143011 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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15404224
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Filing Dt:
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01/12/2017
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Publication #:
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Pub Dt:
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05/04/2017
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Title:
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EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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