Patent Assignment Details
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| Reel/Frame: | 052473/0772 | |
| Pages: | 3 |
| | Recorded: | 04/22/2020 | | |
| Attorney Dkt #: | MEIGI-MEI2PC0423 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2003
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Application #:
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10262003
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Filing Dt:
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09/30/2002
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Publication #:
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Pub Dt:
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02/20/2003
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Title:
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INTEGRATED CIRCUIT DEVICE INCLUDING A LAYERED SUPERLATTICE MATERIAL WITH AN INTERFACE BUFFER LAYER
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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PANASONIC CORPORATION
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2-1-61, SHIROMI, CHUO-KU
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7F OBP PANASONIC TOWER
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OSAKA, 540-6207 JAPAN
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