Patent Assignment Details
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| Reel/Frame: | 052501/0452 | |
| Pages: | 5 |
| | Recorded: | 04/27/2020 | | |
| Attorney Dkt #: | 890102.471 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16677563
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Filing Dt:
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11/07/2019
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Title:
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ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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05/15/2024 05:29 PM
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