Patent Assignment Details
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| Reel/Frame: | 052548/0554 | |
| Pages: | 4 |
| | Recorded: | 05/01/2020 | | |
| Attorney Dkt #: | 9862-000855-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/26/2022
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Application #:
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16863392
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Filing Dt:
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04/30/2020
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Publication #:
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Pub Dt:
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04/22/2021
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Title:
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PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE PACKAGE SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING THE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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05/17/2024 04:38 PM
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