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Reel/Frame:052619/0626   Pages: 16
Recorded: 05/09/2020
Attorney Dkt #:YOR920151291US06
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED AT REEL: 048404 FRAME: 0443. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
Issue Dt:
02/25/2020
Application #:
16282432
Filing Dt:
02/22/2019
Publication #:
Pub Dt:
06/20/2019
Title:
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
Assignors
1
Exec Dt:
12/29/2015
2
Exec Dt:
12/29/2015
3
Exec Dt:
12/28/2015
4
Exec Dt:
12/28/2015
5
Exec Dt:
12/26/2015
6
Exec Dt:
12/28/2015
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
HILDA HEINLEIN
1101 KITCHAWAN ROAD, ROUTE 134, P.O. BOX 218
YORKTOWN, NY 10598

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