Patent Assignment Details
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| Reel/Frame: | 052686/0123 | |
| Pages: | 8 |
| | Recorded: | 05/18/2020 | | |
| Attorney Dkt #: | 6601-0018 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/22/2021
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Application #:
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16876394
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Filing Dt:
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05/18/2020
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Title:
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SEMICONDUCTOR DIE WITH HYBRID WIRE BOND PADS
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Assignee
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| BLDG 1, FL 2, LANE 500 SHENGXIA ROAD |
| ZHANGJIANG, PUDONG NEW DISTRICT |
| SHANGHAI, CHINA |
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Correspondence name and address
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IPRO, PLLC
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12332 TOWNCENTER PLAZA
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PMB# 816
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STERLING, VA 20164
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05/21/2024 08:50 AM
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