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Reel/Frame:052713/0036   Pages: 4
Recorded: 05/20/2020
Attorney Dkt #:H-291 (FP1080079)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
16879028
Filing Dt:
05/20/2020
Publication #:
Pub Dt:
09/02/2021
Title:
REDISTRIBUTION LAYER OF FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
02/25/2020
2
Exec Dt:
02/25/2020
Assignee
1
NO.10, DATONG RD.
HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352
Correspondence name and address
PATENTTM.US JAMES H. WALTERS
205 SE SPOKANE ST STE 300
PORTLAND, OR 97202-6487

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