Patent Assignment Details
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| Reel/Frame: | 052732/0389 | |
| Pages: | 5 |
| | Recorded: | 05/22/2020 | | |
| Attorney Dkt #: | 20132 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/29/2021
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Application #:
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16881197
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Filing Dt:
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05/22/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Title:
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POWER SUPPLY APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT, AND RIPPLE SUPPRESSING METHOD
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Assignee
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| 2-11-2, TSURUMAKI |
| TAMA-SHI, TOKYO, JAPAN 206-8567 |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036-3744
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