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Reel/Frame:052798/0473   Pages: 6
Recorded: 06/01/2020
Attorney Dkt #:BUR920080067US2
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT FIFTH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 021104 FRAME: 0575. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
Issue Dt:
02/21/2012
Application #:
12140364
Filing Dt:
06/17/2008
Publication #:
Pub Dt:
12/17/2009
Title:
STRUCTURE FOR A THROUGH-SILICON-VIA ON-CHIP PASSIVE MMW BANDPASS FILTER
Assignors
1
Exec Dt:
06/05/2008
2
Exec Dt:
06/05/2008
3
Exec Dt:
06/05/2008
4
Exec Dt:
06/05/2008
5
Exec Dt:
06/05/2008
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM (BTV) MICROELECTRONICS
2455 SOUTH RD, P386
ATTN: HILDA HEINLEIN, IPLAW DEPT.
POUGHKEEPSIE, NY 12601-5400

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