Patent Assignment Details
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| Reel/Frame: | 052817/0702 | |
| Pages: | 7 |
| | Recorded: | 06/02/2020 | | |
| Attorney Dkt #: | 097433-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2022
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Application #:
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16886782
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Filing Dt:
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05/29/2020
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Publication #:
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Pub Dt:
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11/04/2021
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH LANDING PADS AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 30352 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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