Patent Assignment Details
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Reel/Frame: | 052826/0623 | |
| Pages: | 4 |
| | Recorded: | 06/03/2020 | | |
Attorney Dkt #: | 7466-1908043 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16769426
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Filing Dt:
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06/03/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, Formed Solder, and Method for Manufacturing Cu Ball
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Assignee
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23, SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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THE WEBB LAW FIRM, P.C.
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ONE GATEWAY CENTER
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420 FT. DUQUESNE BLVD, SUITE 1200
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PITTSBURGH, PA 15222
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05/03/2024 11:11 PM
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