Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052836/0544 | |
| Pages: | 2 |
| | Recorded: | 06/04/2020 | | |
| Attorney Dkt #: | 20374-134906 |
| Conveyance: | CHANGE OF ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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13377457
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Filing Dt:
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12/09/2011
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Publication #:
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Pub Dt:
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04/26/2012
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Title:
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CMP Fluid and Method for Polishing Palladium
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603
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