Patent Assignment Details
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Reel/Frame: | 052845/0181 | |
| Pages: | 6 |
| | Recorded: | 06/04/2020 | | |
Attorney Dkt #: | 16614NDL-USC1C1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/29/2022
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Application #:
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16893348
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Filing Dt:
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06/04/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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HETEROGENEOUSLY INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Assignees
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3F., NO. 106, SEC. 2, HEPING E. RD., DA'AN DIST. |
TAIPEI, TAIWAN 106 |
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21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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YUAN-TE FU
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20800 VALLEY GREEN DR APT 433
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CUPERTINO, CA 95014
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