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Reel/Frame:052845/0181   Pages: 6
Recorded: 06/04/2020
Attorney Dkt #:16614NDL-USC1C1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/29/2022
Application #:
16893348
Filing Dt:
06/04/2020
Publication #:
Pub Dt:
09/24/2020
Title:
HETEROGENEOUSLY INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
05/23/2017
2
Exec Dt:
05/23/2017
3
Exec Dt:
05/23/2017
4
Exec Dt:
05/23/2017
5
Exec Dt:
05/23/2017
6
Exec Dt:
05/15/2017
7
Exec Dt:
05/15/2017
8
Exec Dt:
05/18/2017
9
Exec Dt:
05/18/2017
Assignees
1
3F., NO. 106, SEC. 2, HEPING E. RD., DA'AN DIST.
TAIPEI, TAIWAN 106
2
21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
YUAN-TE FU
20800 VALLEY GREEN DR APT 433
CUPERTINO, CA 95014

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