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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:052907/0650   Pages: 27
Recorded: 06/11/2020
Attorney Dkt #:2515.5050
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 100
Page 1 of 2
Pages: 1 2
1
Patent #:
8026126
Issue Dt:
09/27/2011
Application #:
10628503
Filing Dt:
07/28/2003
Publication #:
US20040115904
Pub Dt:
06/17/2004
Title:
APPARATUS AND METHOD FOR THIN DIE DETACHMENT
2
Patent #:
7994636
Issue Dt:
08/09/2011
Application #:
10849947
Filing Dt:
05/20/2004
Publication #:
US20040212101
Pub Dt:
10/28/2004
Title:
FLIP CHIP INTERCONNECTION STRUCTURE
3
Patent #:
7968377
Issue Dt:
06/28/2011
Application #:
11162785
Filing Dt:
09/22/2005
Publication #:
US20070063322
Pub Dt:
03/22/2007
Title:
INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM
4
Patent #:
7947535
Issue Dt:
05/24/2011
Application #:
11163558
Filing Dt:
10/22/2005
Publication #:
US20070090495
Pub Dt:
04/26/2007
Title:
THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS
5
Patent #:
7968371
Issue Dt:
06/28/2011
Application #:
11164336
Filing Dt:
11/18/2005
Publication #:
US20060170092
Pub Dt:
08/03/2006
Title:
SEMICONDUCTOR PACKAGE SYSTEM WITH CAVITY SUBSTRATE
6
Patent #:
7939368
Issue Dt:
05/10/2011
Application #:
11276611
Filing Dt:
03/07/2006
Publication #:
US20070212812
Pub Dt:
09/13/2007
Title:
WAFER LEVEL CHIP SCALE PACKAGE SYSTEM WITH A THERMAL DISSIPATION STRUCTURE
7
Patent #:
7986043
Issue Dt:
07/26/2011
Application #:
11276646
Filing Dt:
03/08/2006
Publication #:
US20070210443
Pub Dt:
09/13/2007
Title:
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
8
Patent #:
7981702
Issue Dt:
07/19/2011
Application #:
11276647
Filing Dt:
03/08/2006
Publication #:
US20070210424
Pub Dt:
09/13/2007
Title:
INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM
9
Patent #:
8026129
Issue Dt:
09/27/2011
Application #:
11276682
Filing Dt:
03/10/2006
Publication #:
US20070210432
Pub Dt:
09/13/2007
Title:
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
10
Patent #:
8003443
Issue Dt:
08/23/2011
Application #:
11276684
Filing Dt:
03/10/2006
Publication #:
US20070212903
Pub Dt:
09/13/2007
Title:
NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE GROUND SITES
11
Patent #:
7977579
Issue Dt:
07/12/2011
Application #:
11278070
Filing Dt:
03/30/2006
Publication #:
US20070235215
Pub Dt:
10/11/2007
Title:
MULTIPLE FLIP-CHIP INTEGRATED CIRCUIT PACKAGE SYSTEM
12
Patent #:
7947534
Issue Dt:
05/24/2011
Application #:
11307383
Filing Dt:
02/04/2006
Publication #:
US20070182024
Pub Dt:
08/09/2007
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING A NON-LEADED PACKAGE
13
Patent #:
8030755
Issue Dt:
10/04/2011
Application #:
11307532
Filing Dt:
02/10/2006
Publication #:
US20070108587
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH A HEAT SINK
14
Patent #:
7975377
Issue Dt:
07/12/2011
Application #:
11379011
Filing Dt:
04/17/2006
Publication #:
US20070109749
Pub Dt:
05/17/2007
Title:
WAFER SCALE HEAT SLUG SYSTEM
15
Patent #:
8009436
Issue Dt:
08/30/2011
Application #:
11380652
Filing Dt:
04/27/2006
Publication #:
US20070109757
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CHANNEL
16
Patent #:
7993939
Issue Dt:
08/09/2011
Application #:
11459325
Filing Dt:
07/21/2006
Publication #:
US20080017960
Pub Dt:
01/24/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LAMINATE BASE
17
Patent #:
7936055
Issue Dt:
05/03/2011
Application #:
11466748
Filing Dt:
08/23/2006
Publication #:
US20080054421
Pub Dt:
03/06/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERLOCK
18
Patent #:
7952209
Issue Dt:
05/31/2011
Application #:
11536242
Filing Dt:
09/28/2006
Publication #:
US20080079173
Pub Dt:
04/03/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PAD TO PAD BONDING
19
Patent #:
7994619
Issue Dt:
08/09/2011
Application #:
11555682
Filing Dt:
11/01/2006
Publication #:
US20080111222
Pub Dt:
05/15/2008
Title:
BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
20
Patent #:
7936053
Issue Dt:
05/03/2011
Application #:
11558387
Filing Dt:
11/09/2006
Publication #:
US20070114645
Pub Dt:
05/24/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD STRUCTURES INCLUDING A DUMMY TIE BAR
21
Patent #:
7928540
Issue Dt:
04/19/2011
Application #:
11558589
Filing Dt:
11/10/2006
Publication #:
US20080111215
Pub Dt:
05/15/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM
22
Patent #:
8017502
Issue Dt:
09/13/2011
Application #:
11615929
Filing Dt:
12/22/2006
Publication #:
US20080153262
Pub Dt:
06/26/2008
Title:
WAFER SYSTEM WITH PARTIAL CUTS
23
Patent #:
8012867
Issue Dt:
09/06/2011
Application #:
11618647
Filing Dt:
12/29/2006
Publication #:
US20070178667
Pub Dt:
08/02/2007
Title:
WAFER LEVEL CHIP SCALE PACKAGE SYSTEM
24
Patent #:
8035207
Issue Dt:
10/11/2011
Application #:
11618807
Filing Dt:
12/30/2006
Publication #:
US20080157321
Pub Dt:
07/03/2008
Title:
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH RECESS
25
Patent #:
7985623
Issue Dt:
07/26/2011
Application #:
11735397
Filing Dt:
04/13/2007
Publication #:
US20070262473
Pub Dt:
11/15/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION
26
Patent #:
7977778
Issue Dt:
07/12/2011
Application #:
11744697
Filing Dt:
05/04/2007
Publication #:
US20080273312
Pub Dt:
11/06/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERFERENCE-FIT FEATURE
27
Patent #:
8018052
Issue Dt:
09/13/2011
Application #:
11772044
Filing Dt:
06/29/2007
Publication #:
US20090001545
Pub Dt:
01/01/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SIDE SUBSTRATE HAVING A TOP LAYER
28
Patent #:
8008787
Issue Dt:
08/30/2011
Application #:
11857206
Filing Dt:
09/18/2007
Publication #:
US20090072377
Pub Dt:
03/19/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE
29
Patent #:
7989931
Issue Dt:
08/02/2011
Application #:
11861926
Filing Dt:
09/26/2007
Publication #:
US20090079048
Pub Dt:
03/26/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS
30
Patent #:
7977782
Issue Dt:
07/12/2011
Application #:
11936532
Filing Dt:
11/07/2007
Publication #:
US20090115032
Pub Dt:
05/07/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY
31
Patent #:
7985628
Issue Dt:
07/26/2011
Application #:
11954607
Filing Dt:
12/12/2007
Publication #:
US20090152706
Pub Dt:
06/18/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT LOCK
32
Patent #:
7948066
Issue Dt:
05/24/2011
Application #:
11964501
Filing Dt:
12/26/2007
Publication #:
US20090166823
Pub Dt:
07/02/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD LOCKING STRUCTURE
33
Patent #:
7993979
Issue Dt:
08/09/2011
Application #:
11964567
Filing Dt:
12/26/2007
Publication #:
US20090166824
Pub Dt:
07/02/2009
Title:
LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS
34
Patent #:
8035210
Issue Dt:
10/11/2011
Application #:
11966219
Filing Dt:
12/28/2007
Publication #:
US20090166835
Pub Dt:
07/02/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER
35
Patent #:
8026582
Issue Dt:
09/27/2011
Application #:
12025745
Filing Dt:
02/04/2008
Publication #:
US20090194867
Pub Dt:
08/06/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADHESIVE
36
Patent #:
7993972
Issue Dt:
08/09/2011
Application #:
12042026
Filing Dt:
03/04/2008
Publication #:
US20090224391
Pub Dt:
09/10/2009
Title:
WAFER LEVEL DIE INTEGRATION AND METHOD THEREFOR
37
Patent #:
8018039
Issue Dt:
09/13/2011
Application #:
12043789
Filing Dt:
03/06/2008
Publication #:
US20090224389
Pub Dt:
09/10/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
38
Patent #:
7989269
Issue Dt:
08/02/2011
Application #:
12047979
Filing Dt:
03/13/2008
Publication #:
US20090230531
Pub Dt:
09/17/2009
Title:
SEMICONDUCTOR PACKAGE WITH PENETRABLE ENCAPSULANT JOINING SEMICONDUCTOR DIE AND METHOD THEREOF
39
Patent #:
7989941
Issue Dt:
08/02/2011
Application #:
12051267
Filing Dt:
03/19/2008
Publication #:
US20090236751
Pub Dt:
09/24/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG
40
Patent #:
8035211
Issue Dt:
10/11/2011
Application #:
12055634
Filing Dt:
03/26/2008
Publication #:
US20090243070
Pub Dt:
10/01/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE
41
Patent #:
7968981
Issue Dt:
06/28/2011
Application #:
12101915
Filing Dt:
04/11/2008
Publication #:
US20090258494
Pub Dt:
10/15/2009
Title:
INLINE INTEGRATED CIRCUIT SYSTEM
42
Patent #:
7968373
Issue Dt:
06/28/2011
Application #:
12114744
Filing Dt:
05/02/2008
Publication #:
US20090273094
Pub Dt:
11/05/2009
Title:
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
43
Patent #:
8030136
Issue Dt:
10/04/2011
Application #:
12121682
Filing Dt:
05/15/2008
Publication #:
US20090283870
Pub Dt:
11/19/2009
Title:
SEMICONDUCTOR DEVICE AND METHOD OF CONFORMING CONDUCTIVE VIAS BETWEEN INSULATING LAYERS IN SAW STREETS
44
Patent #:
7923846
Issue Dt:
04/12/2011
Application #:
12121752
Filing Dt:
05/15/2008
Publication #:
US20090127680
Pub Dt:
05/21/2009
Title:
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH WIRE-IN-FILM ENCAPSULANT
45
Patent #:
8021907
Issue Dt:
09/20/2011
Application #:
12135830
Filing Dt:
06/09/2008
Publication #:
US20090302445
Pub Dt:
12/10/2009
Title:
METHOD AND APPARATUS FOR THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
46
Patent #:
8031475
Issue Dt:
10/04/2011
Application #:
12136007
Filing Dt:
06/09/2008
Publication #:
US20090016033
Pub Dt:
01/15/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE
47
Patent #:
7977779
Issue Dt:
07/12/2011
Application #:
12136768
Filing Dt:
06/10/2008
Publication #:
US20090302452
Pub Dt:
12/10/2009
Title:
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
48
Patent #:
7969023
Issue Dt:
06/28/2011
Application #:
12142743
Filing Dt:
06/19/2008
Publication #:
US20090020893
Pub Dt:
01/22/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER HAVING EMBEDDED FILLERS AND METHOD OF MANUFACTURE THEREOF
49
Patent #:
7968979
Issue Dt:
06/28/2011
Application #:
12146124
Filing Dt:
06/25/2008
Publication #:
US20090321898
Pub Dt:
12/31/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONFORMAL SHIELDING AND METHOD OF MANUFACTURE THEREOF
50
Patent #:
7956449
Issue Dt:
06/07/2011
Application #:
12146135
Filing Dt:
06/25/2008
Publication #:
US20090321907
Pub Dt:
12/31/2009
Title:
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
51
Patent #:
7994645
Issue Dt:
08/09/2011
Application #:
12169342
Filing Dt:
07/08/2008
Publication #:
US20090014893
Pub Dt:
01/15/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ISOLATION BARRIER
52
Patent #:
7932130
Issue Dt:
04/26/2011
Application #:
12185058
Filing Dt:
08/01/2008
Publication #:
US20100025830
Pub Dt:
02/04/2010
Title:
A METHOD FOR FORMING AN ETCHED RECESS PACKAGE ON PACKAGE SYSTEM
53
Patent #:
8004093
Issue Dt:
08/23/2011
Application #:
12185063
Filing Dt:
08/01/2008
Publication #:
US20100025835
Pub Dt:
02/04/2010
Title:
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
54
Patent #:
7977780
Issue Dt:
07/12/2011
Application #:
12185067
Filing Dt:
08/01/2008
Publication #:
US20100025836
Pub Dt:
02/04/2010
Title:
MULTI-LAYER PACKAGE-ON-PACKAGE SYSTEM
55
Patent #:
7989950
Issue Dt:
08/02/2011
Application #:
12192052
Filing Dt:
08/14/2008
Publication #:
US20100038781
Pub Dt:
02/18/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
56
Patent #:
8039311
Issue Dt:
10/18/2011
Application #:
12205841
Filing Dt:
09/05/2008
Publication #:
US20100059884
Pub Dt:
03/11/2010
Title:
LEADLESS SEMICONDUCTOR CHIP CARRIER SYSTEM
57
Patent #:
7928564
Issue Dt:
04/19/2011
Application #:
12237276
Filing Dt:
09/24/2008
Publication #:
US20090014866
Pub Dt:
01/15/2009
Title:
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
58
Patent #:
7994624
Issue Dt:
08/09/2011
Application #:
12237344
Filing Dt:
09/24/2008
Publication #:
US20100072630
Pub Dt:
03/25/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ADHESIVE SEGMENT SPACER
59
Patent #:
8022538
Issue Dt:
09/20/2011
Application #:
12272747
Filing Dt:
11/17/2008
Publication #:
US20100123247
Pub Dt:
05/20/2010
Title:
BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
60
Patent #:
8022539
Issue Dt:
09/20/2011
Application #:
12272765
Filing Dt:
11/17/2008
Publication #:
US20100123227
Pub Dt:
05/20/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
61
Patent #:
7994625
Issue Dt:
08/09/2011
Application #:
12273540
Filing Dt:
11/18/2008
Publication #:
US20100123232
Pub Dt:
05/20/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF
62
Patent #:
7951643
Issue Dt:
05/31/2011
Application #:
12325193
Filing Dt:
11/29/2008
Publication #:
US20100133665
Pub Dt:
06/03/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF
63
Patent #:
7993941
Issue Dt:
08/09/2011
Application #:
12329458
Filing Dt:
12/05/2008
Publication #:
US20100140771
Pub Dt:
06/10/2010
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING Z-DIRECTION CONDUCTIVE POSTS EMBEDDED IN STRUCTURALLY PROTECTIVE ENCAPSULANT
64
Patent #:
7994629
Issue Dt:
08/09/2011
Application #:
12329467
Filing Dt:
12/05/2008
Publication #:
US20100140765
Pub Dt:
06/10/2010
Title:
LEADLESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
65
Patent #:
7952176
Issue Dt:
05/31/2011
Application #:
12331347
Filing Dt:
12/09/2008
Publication #:
US20100140813
Pub Dt:
06/10/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
66
Patent #:
7986048
Issue Dt:
07/26/2011
Application #:
12388516
Filing Dt:
02/18/2009
Publication #:
US20100207262
Pub Dt:
08/19/2010
Title:
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTURE THEREOF
67
Patent #:
8035237
Issue Dt:
10/11/2011
Application #:
12398163
Filing Dt:
03/04/2009
Publication #:
US20090174064
Pub Dt:
07/09/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SLUG
68
Patent #:
7977802
Issue Dt:
07/12/2011
Application #:
12398782
Filing Dt:
03/05/2009
Publication #:
US20100225007
Pub Dt:
09/09/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED DIE AND METHOD OF MANUFACTURE THEREOF
69
Patent #:
7960815
Issue Dt:
06/14/2011
Application #:
12398806
Filing Dt:
03/05/2009
Publication #:
US20090166821
Pub Dt:
07/02/2009
Title:
LEADFRAME DESIGN FOR QFN PACKAGE WITH TOP TERMINAL LEADS
70
Patent #:
7989270
Issue Dt:
08/02/2011
Application #:
12404134
Filing Dt:
03/13/2009
Publication #:
US20100230806
Pub Dt:
09/16/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THREE-DIMENSIONAL VERTICALLY ORIENTED INTEGRATED CAPACITORS
71
Patent #:
7964952
Issue Dt:
06/21/2011
Application #:
12409489
Filing Dt:
03/24/2009
Publication #:
US20090179319
Pub Dt:
07/16/2009
Title:
STACKED SEMICONDUCTOR PACKAGE ASSEMBLY HAVING HOLLOWED SUBSTRATE
72
Patent #:
8022514
Issue Dt:
09/20/2011
Application #:
12410463
Filing Dt:
03/25/2009
Publication #:
US20090179314
Pub Dt:
07/16/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT
73
Patent #:
8039316
Issue Dt:
10/18/2011
Application #:
12423099
Filing Dt:
04/14/2009
Publication #:
US20100258928
Pub Dt:
10/14/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND HEAT SPREADER WITH OPENINGS AND METHOD OF MANUFACTURE THEREOF
74
Patent #:
8018040
Issue Dt:
09/13/2011
Application #:
12423320
Filing Dt:
04/14/2009
Publication #:
US20090194853
Pub Dt:
08/06/2009
Title:
SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
75
Patent #:
7932593
Issue Dt:
04/26/2011
Application #:
12433852
Filing Dt:
04/30/2009
Publication #:
US20090218675
Pub Dt:
09/03/2009
Title:
MULTIPACKAGE MODULE HAVING STACKED PACKAGES WITH ASYMMETRICALLY ARRANGED DIE AND MOLDING
76
Patent #:
8018034
Issue Dt:
09/13/2011
Application #:
12434367
Filing Dt:
05/01/2009
Publication #:
US20100276792
Pub Dt:
11/04/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER AFTER ENCAPSULATION AND GROUNDED THROUGH INTERCONNECT STRUCTURE
77
Patent #:
8026127
Issue Dt:
09/27/2011
Application #:
12467133
Filing Dt:
05/15/2009
Publication #:
US20090283893
Pub Dt:
11/19/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SLOTTED DIE PADDLE AND METHOD OF MANUFACTURE THEREOF
78
Patent #:
7998790
Issue Dt:
08/16/2011
Application #:
12474757
Filing Dt:
05/29/2009
Publication #:
US20090302442
Pub Dt:
12/10/2009
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF
79
Patent #:
8039303
Issue Dt:
10/18/2011
Application #:
12481404
Filing Dt:
06/09/2009
Publication #:
US20090309212
Pub Dt:
12/17/2009
Title:
METHOD OF FORMING STRESS RELIEF LAYER BETWEEN DIE AND INTERCONNECT STRUCTURE
80
Patent #:
7968995
Issue Dt:
06/28/2011
Application #:
12483087
Filing Dt:
06/11/2009
Publication #:
US20100314736
Pub Dt:
12/16/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
81
Patent #:
7993976
Issue Dt:
08/09/2011
Application #:
12484143
Filing Dt:
06/12/2009
Publication #:
US20100317153
Pub Dt:
12/16/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE VIAS WITH TRENCH IN SAW STREET
82
Patent #:
8004073
Issue Dt:
08/23/2011
Application #:
12486568
Filing Dt:
06/17/2009
Publication #:
US20100320619
Pub Dt:
12/23/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF
83
Patent #:
7927917
Issue Dt:
04/19/2011
Application #:
12488089
Filing Dt:
06/19/2009
Publication #:
US20100320582
Pub Dt:
12/23/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
84
Patent #:
7960841
Issue Dt:
06/14/2011
Application #:
12496046
Filing Dt:
07/01/2009
Publication #:
US20090267236
Pub Dt:
10/29/2009
Title:
THROUGH-HOLE VIA ON SAW STREETS
85
Patent #:
8039304
Issue Dt:
10/18/2011
Application #:
12540174
Filing Dt:
08/12/2009
Publication #:
US20110037169
Pub Dt:
02/17/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF DUAL-MOLDING DIE FORMED ON OPPOSITE SIDES OF BUILD-UP INTERCONNECT STRUCTURES
86
Patent #:
8021930
Issue Dt:
09/20/2011
Application #:
12540240
Filing Dt:
08/12/2009
Publication #:
US20110037155
Pub Dt:
02/17/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING DAM MATERIAL AROUND PERIPHERY OF DIE TO REDUCE WARPAGE
87
Patent #:
7986032
Issue Dt:
07/26/2011
Application #:
12547439
Filing Dt:
08/25/2009
Publication #:
US20090309237
Pub Dt:
12/17/2009
Title:
SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS
88
Patent #:
8035235
Issue Dt:
10/11/2011
Application #:
12560312
Filing Dt:
09/15/2009
Publication #:
US20110062574
Pub Dt:
03/17/2011
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
89
Patent #:
7968996
Issue Dt:
06/28/2011
Application #:
12565698
Filing Dt:
09/23/2009
Publication #:
US20100001391
Pub Dt:
01/07/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORTED STACKED DIE
90
Patent #:
8008121
Issue Dt:
08/30/2011
Application #:
12612365
Filing Dt:
11/04/2009
Publication #:
US20110101512
Pub Dt:
05/05/2011
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO OPPOSITE SIDES OF TSV SUBSTRATE
91
Patent #:
7958628
Issue Dt:
06/14/2011
Application #:
12635536
Filing Dt:
12/10/2009
Publication #:
US20100083494
Pub Dt:
04/08/2010
Title:
BONDING TOOL FOR MOUNTING SEMICONDUCTOR CHIPS
92
Patent #:
7973406
Issue Dt:
07/05/2011
Application #:
12716455
Filing Dt:
03/03/2010
Publication #:
US20100164100
Pub Dt:
07/01/2010
Title:
BUMP-ON-LEAD FLIP CHIP INTERCONNECTION
93
Patent #:
7928552
Issue Dt:
04/19/2011
Application #:
12722759
Filing Dt:
03/12/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-TIER CONDUCTIVE INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
94
Patent #:
8018041
Issue Dt:
09/13/2011
Application #:
12759158
Filing Dt:
04/13/2010
Publication #:
US20100193926
Pub Dt:
08/05/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKED DIE
95
Patent #:
7923822
Issue Dt:
04/12/2011
Application #:
12762602
Filing Dt:
04/19/2010
Publication #:
US20100200967
Pub Dt:
08/12/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD
96
Patent #:
8030769
Issue Dt:
10/04/2011
Application #:
12763390
Filing Dt:
04/20/2010
Publication #:
US20100200986
Pub Dt:
08/12/2010
Title:
GROOVING BUMPED WAFER PRE-UNDERFILL SYSTEM
97
Patent #:
8039275
Issue Dt:
10/18/2011
Application #:
12792629
Filing Dt:
06/02/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
98
Patent #:
8004095
Issue Dt:
08/23/2011
Application #:
12822080
Filing Dt:
06/23/2010
Publication #:
US20100258937
Pub Dt:
10/14/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE FOR ENCAPSULATED DIE HAVING PRE-APPLIED PROTECTIVE LAYER
99
Patent #:
8022531
Issue Dt:
09/20/2011
Application #:
12880415
Filing Dt:
09/13/2010
Publication #:
US20100327418
Pub Dt:
12/30/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG
100
Patent #:
8021924
Issue Dt:
09/20/2011
Application #:
12892907
Filing Dt:
09/28/2010
Publication #:
US20110018084
Pub Dt:
01/27/2011
Title:
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF
Assignor
1
CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Exec Dt:
05/03/2019
Assignees
1
STATS CHIPPAC, INC.
46429 LANDING PARKWAY
FREMONT, CALIFORNIA 94538
2
STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
5 YISHUN STREET 23
SINGAPORE, SINGAPORE 768442
Correspondence name and address
PATENT LAW GROUP: ATKINS AND ASSOCIATES
123 W. CHANDLER HEIGHTS ROAD, #12535
CHANDLER, AZ 85248

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