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11/23/2006
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08/03/2010
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04/20/2010
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02/01/2007
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09/22/2009
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02/14/2008
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02/14/2008
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12/07/2006
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12/29/2009
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02/21/2008
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08/31/2010
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08/16/2006
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06/09/2009
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08/18/2006
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02/21/2008
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04/15/2008
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08/28/2006
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03/13/2012
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09/18/2006
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03/20/2008
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05/25/2010
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01/18/2007
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05/24/2011
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09/26/2006
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01/25/2007
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05/18/2010
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09/11/2006
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03/15/2007
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09/27/2011
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03/15/2007
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03/31/2009
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10/12/2006
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04/17/2008
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01/19/2010
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09/28/2006
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10/02/2008
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04/21/2009
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10/10/2006
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06/07/2007
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04/13/2010
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10/13/2006
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04/06/2010
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10/13/2006
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09/07/2010
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10/17/2006
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06/09/2009
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10/17/2006
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10/11/2011
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11/20/2006
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06/19/2008
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08/03/2010
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11/30/2006
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02/21/2008
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06/30/2009
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12/06/2006
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06/14/2007
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11/02/2010
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11/15/2006
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08/16/2007
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09/29/2009
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03/09/2007
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12/25/2008
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08/18/2009
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03/29/2007
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03/13/2008
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10/18/2011
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10/13/2006
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05/17/2007
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05/18/2010
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10/17/2006
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04/17/2008
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07/20/2010
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10/17/2006
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04/17/2008
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10/30/2012
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10/18/2006
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05/01/2008
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05/10/2007
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08/24/2010
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02/22/2007
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INTEGRATED CIRCUIT DEVICE
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05/10/2011
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10/26/2006
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02/22/2007
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11/26/2013
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02/22/2007
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Integrated circuit device
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05/03/2011
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08/04/2009
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10/31/2006
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05/01/2008
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12/16/2008
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11/09/2006
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05/10/2007
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08/04/2009
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11/15/2006
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05/15/2008
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10/29/2013
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11/22/2006
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05/22/2008
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09/07/2010
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11/22/2006
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05/22/2008
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02/09/2010
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11/30/2006
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06/05/2008
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06/30/2009
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12/01/2006
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04/05/2007
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02/16/2010
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10/27/2009
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07/24/2008
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04/07/2009
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12/04/2006
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04/05/2007
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10/18/2011
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06/05/2008
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NETWORK RADIO RECEIVER
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12/09/2008
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12/20/2006
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05/03/2007
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09/14/2010
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12/20/2006
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05/03/2007
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12/20/2006
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06/28/2007
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07/06/2010
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12/20/2006
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06/26/2008
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09/06/2011
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12/22/2006
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06/26/2008
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03/23/2010
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12/21/2006
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06/26/2008
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06/21/2011
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12/21/2006
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06/26/2008
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10/13/2009
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12/27/2006
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06/28/2007
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12/18/2007
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12/28/2006
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05/10/2007
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05/31/2011
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12/28/2006
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07/03/2008
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05/04/2010
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12/29/2006
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07/03/2008
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12/10/2013
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07/10/2008
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Title:
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MICROELECTRONIC ASSEMBLY WITH MULTI-LAYER SUPPORT STRUCTURE
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Patent #:
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Issue Dt:
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05/03/2011
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Application #:
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11655777
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Filing Dt:
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01/19/2007
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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WAFER LEVEL CHIP PACKAGING
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Patent #:
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Issue Dt:
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03/17/2009
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Application #:
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11657286
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Filing Dt:
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01/24/2007
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Publication #:
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Pub Dt:
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05/31/2007
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Title:
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MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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11666975
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Filing Dt:
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08/25/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Title:
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STACKED PACKAGING IMPROVEMENTS
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Patent #:
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Issue Dt:
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04/13/2010
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Application #:
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11676991
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Filing Dt:
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02/20/2007
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Title:
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AUTO-FOCUS WITH LENS VIBRATION
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Patent #:
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Issue Dt:
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05/18/2010
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Application #:
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11696128
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Filing Dt:
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04/03/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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AUDIO SIGNAL PROCESSING
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11698602
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Filing Dt:
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01/25/2007
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Publication #:
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Pub Dt:
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07/31/2008
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Title:
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STACKED INTEGRATED CIRCUIT ASSEMBLY
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11699852
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Filing Dt:
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01/30/2007
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Publication #:
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Pub Dt:
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06/21/2007
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Title:
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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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11704713
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Filing Dt:
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02/09/2007
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Publication #:
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Pub Dt:
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04/10/2008
| | | | |
Title:
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EDGE CONNECT WAFER LEVEL STACKING
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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11710752
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Filing Dt:
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02/26/2007
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Publication #:
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Pub Dt:
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12/20/2007
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Title:
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STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME
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Patent #:
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Issue Dt:
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03/15/2011
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Application #:
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11715862
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Filing Dt:
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03/07/2007
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Publication #:
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Pub Dt:
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04/24/2008
| | | | |
Title:
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PROCESSING OF MOSAIC IMAGES
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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11717587
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Filing Dt:
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03/13/2007
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Publication #:
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Pub Dt:
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01/03/2008
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Title:
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Fine pitch microcontacts and method for forming thereof
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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11717953
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Filing Dt:
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03/14/2007
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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09/17/2013
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Application #:
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11735803
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Filing Dt:
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04/16/2007
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Title:
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MEMS DEVICE WITH INTEGRATED MEMORY CELLS
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Patent #:
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Issue Dt:
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01/22/2013
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Application #:
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11744142
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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12/13/2007
| | | | |
Title:
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ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11744153
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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11/01/2007
| | | | |
Title:
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DIE ASSEMBLY HAVING ELECTRICAL INTERCONNECT
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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11757513
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Filing Dt:
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06/04/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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METHOD AND APPARATUS FOR IMPLEMENTING SEEK AND SCAN FUNCTIONS FOR AN FM DIGITAL RADIO SIGNAL
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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11757574
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Filing Dt:
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06/04/2007
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Publication #:
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Pub Dt:
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12/04/2008
| | | | |
Title:
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METHOD AND APPARATUS FOR IMPLEMENTING A DIGITAL SIGNAL QUALITY METRIC
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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11758386
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Filing Dt:
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06/05/2007
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Publication #:
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Pub Dt:
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10/04/2007
| | | | |
Title:
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ROOM TEMPERATURE METAL DIRECT BONDING
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11759823
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Filing Dt:
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06/07/2007
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Publication #:
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Pub Dt:
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07/24/2008
| | | | |
Title:
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OPTIMIZED CHARGE SHARING FOR DATA BUS SKEW APPLICATIONS
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Patent #:
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Issue Dt:
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08/25/2009
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Application #:
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11764007
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Filing Dt:
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06/15/2007
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Publication #:
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Pub Dt:
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12/18/2008
| | | | |
Title:
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MULTIPLE BUS CHARGE SHARING
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11774991
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Filing Dt:
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07/09/2007
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Publication #:
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Pub Dt:
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01/17/2008
| | | | |
Title:
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SYSTEMS AND METHODS FOR MULTI-DIALOG SURROUND AUDIO
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11784810
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Filing Dt:
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04/10/2007
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Publication #:
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Pub Dt:
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09/13/2007
| | | | |
Title:
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METHODS OF MAKING MICROELECTRONIC ASSEMBLIES
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11785612
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Filing Dt:
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04/19/2007
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Publication #:
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Pub Dt:
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08/23/2007
| | | | |
Title:
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WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11787209
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Filing Dt:
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04/13/2007
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Publication #:
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Pub Dt:
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04/10/2008
| | | | |
Title:
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EDGE CONNECT WAFER LEVEL STACKING
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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11789694
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Filing Dt:
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04/25/2007
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Publication #:
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Pub Dt:
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05/01/2008
| | | | |
Title:
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WAFER-LEVEL FABRICATION OF LIDDED CHIPS WITH ELECTRODEPOSITED DIELECTRIC COATING
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Patent #:
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Issue Dt:
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01/08/2013
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Application #:
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11789911
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Filing Dt:
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04/26/2007
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Publication #:
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Pub Dt:
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11/08/2007
| | | | |
Title:
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SYSTEM FOR MANAGING DATA OBJECTS
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Patent #:
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Issue Dt:
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03/09/2010
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Application #:
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11797293
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Filing Dt:
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05/02/2007
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Publication #:
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Pub Dt:
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09/06/2007
| | | | |
Title:
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SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, AND METHODS OF PRODUCING SAME DEVICE AND WAFER
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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11799023
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Filing Dt:
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04/30/2007
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Publication #:
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Pub Dt:
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12/13/2007
| | | | |
Title:
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SUBSTRATE TREATING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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11799771
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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09/06/2007
| | | | |
Title:
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MICROELECTRONIC PACKAGES AND METHODS THEREFOR
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Patent #:
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Issue Dt:
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04/13/2010
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Application #:
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11801336
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Filing Dt:
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05/09/2007
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Publication #:
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Pub Dt:
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04/24/2008
| | | | |
Title:
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LAYERED METAL STRUCTURE FOR INTERCONNECT ELEMENT
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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11803006
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Filing Dt:
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05/11/2007
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Publication #:
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Pub Dt:
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11/13/2008
| | | | |
Title:
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ULTRA-THIN NEAR-HERMETIC PACKAGE BASED ON RAINIER
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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11808808
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Filing Dt:
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06/13/2007
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Publication #:
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Pub Dt:
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10/18/2007
| | | | |
Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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11809213
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Filing Dt:
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05/30/2007
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Publication #:
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Pub Dt:
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12/04/2008
| | | | |
Title:
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CHIP ASSEMBLY INCLUDING PACKAGE ELEMENT AND INTEGRATED CIRCUIT CHIP
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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11809214
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Filing Dt:
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05/30/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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MICROELECTRONIC PACKAGE HAVING INTERCONNECTED REDISTRIBUTION PATHS
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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11817019
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Filing Dt:
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04/22/2008
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Publication #:
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Pub Dt:
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10/30/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE DEVICE WITH IMPROVED BOND PAD CONNECTIONS, A LEAD-FRAME AND AN ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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12/21/2010
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Application #:
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11821540
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Filing Dt:
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06/22/2007
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Publication #:
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Pub Dt:
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12/25/2008
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Title:
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LOW LOSS RF TRANSMISSION LINES HAVING A REFERENCE CONDUCTOR WITH A RECESS PORTION OPPOSITE A SIGNAL CONDUCTOR
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Patent #:
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Issue Dt:
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03/22/2011
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Application #:
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11824484
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Filing Dt:
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06/29/2007
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Publication #:
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Pub Dt:
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01/01/2009
| | | | |
Title:
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MULTILAYER WIRING ELEMENT HAVING PIN INTERFACE
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Patent #:
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Issue Dt:
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07/27/2010
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Application #:
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11825121
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Filing Dt:
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07/02/2007
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Publication #:
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Pub Dt:
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01/08/2009
| | | | |
Title:
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STACKABLE MICROELECTRONIC DEVICE CARRIERS, STACKED DEVICE CARRIERS AND METHODS OF MAKING THE SAME
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