|
|
Patent #:
|
|
Issue Dt:
|
10/20/2015
|
Application #:
|
13709723
|
Filing Dt:
|
12/10/2012
|
Publication #:
|
|
Pub Dt:
|
06/12/2014
| | | | |
Title:
|
HIGH PERFORMANCE PACKAGE ON PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2015
|
Application #:
|
13711042
|
Filing Dt:
|
12/11/2012
|
Publication #:
|
|
Pub Dt:
|
06/12/2014
| | | | |
Title:
|
METHOD AND STRUCTURES FOR VIA SUBSTRATE REPAIR AND ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/2014
|
Application #:
|
13711091
|
Filing Dt:
|
12/11/2012
|
Publication #:
|
|
Pub Dt:
|
04/25/2013
| | | | |
Title:
|
MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CONNECTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2015
|
Application #:
|
13720346
|
Filing Dt:
|
12/19/2012
|
Publication #:
|
|
Pub Dt:
|
06/19/2014
| | | | |
Title:
|
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2016
|
Application #:
|
13720725
|
Filing Dt:
|
12/19/2012
|
Publication #:
|
|
Pub Dt:
|
06/27/2013
| | | | |
Title:
|
BASS ENHANCEMENT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
13722189
|
Filing Dt:
|
12/20/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/2015
|
Application #:
|
13722340
|
Filing Dt:
|
12/20/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
METHOD OF THINNING A WAFER TO PROVIDE A RAISED PERIPHERAL EDGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2016
|
Application #:
|
13722365
|
Filing Dt:
|
12/20/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2015
|
Application #:
|
13724223
|
Filing Dt:
|
12/21/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2014
|
Application #:
|
13725284
|
Filing Dt:
|
12/21/2012
|
Publication #:
|
|
Pub Dt:
|
05/02/2013
| | | | |
Title:
|
DIGITAL RADIO BROADCAST RECEIVER, BROADCASTING METHODS AND METHODS FOR TAGGING CONTENT OF INTEREST
|
|
|
Patent #:
|
|
Issue Dt:
|
01/27/2015
|
Application #:
|
13725923
|
Filing Dt:
|
12/21/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
NON-CRYSTALLINE INORGANIC LIGHT EMITTING DIODE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/2016
|
Application #:
|
13727421
|
Filing Dt:
|
12/26/2012
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
SYSTEMS AND METHODS OF FREQUENCY RESPONSE CORRECTION FOR CONSUMER ELECTRONIC DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13728246
|
Filing Dt:
|
12/27/2012
|
Publication #:
|
|
Pub Dt:
|
08/15/2013
| | | | |
Title:
|
ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/2014
|
Application #:
|
13731242
|
Filing Dt:
|
12/31/2012
|
Publication #:
|
|
Pub Dt:
|
06/06/2013
| | | | |
Title:
|
METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2014
|
Application #:
|
13732275
|
Filing Dt:
|
12/31/2012
|
Publication #:
|
|
Pub Dt:
|
01/16/2014
| | | | |
Title:
|
HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
13732276
|
Filing Dt:
|
12/31/2012
|
Publication #:
|
|
Pub Dt:
|
05/23/2013
| | | | |
Title:
|
AUTOFOCUS CAMERA SYSTEMS AND METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
13734500
|
Filing Dt:
|
01/04/2013
|
Publication #:
|
|
Pub Dt:
|
05/16/2013
| | | | |
Title:
|
NON-VOLATILE ONE-TIME-PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY CONFIGURATION CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2015
|
Application #:
|
13741890
|
Filing Dt:
|
01/15/2013
|
Publication #:
|
|
Pub Dt:
|
05/23/2013
| | | | |
Title:
|
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13746571
|
Filing Dt:
|
01/22/2013
|
Publication #:
|
|
Pub Dt:
|
07/24/2014
| | | | |
Title:
|
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2014
|
Application #:
|
13752485
|
Filing Dt:
|
01/29/2013
|
Publication #:
|
|
Pub Dt:
|
08/29/2013
| | | | |
Title:
|
METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/27/2015
|
Application #:
|
13757673
|
Filing Dt:
|
02/01/2013
|
Publication #:
|
|
Pub Dt:
|
08/07/2014
| | | | |
Title:
|
METHOD OF MAKING WIRE BOND VIAS AND MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2015
|
Application #:
|
13757677
|
Filing Dt:
|
02/01/2013
|
Publication #:
|
|
Pub Dt:
|
08/07/2014
| | | | |
Title:
|
MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2014
|
Application #:
|
13758412
|
Filing Dt:
|
02/04/2013
|
Publication #:
|
|
Pub Dt:
|
08/07/2014
| | | | |
Title:
|
MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2016
|
Application #:
|
13776035
|
Filing Dt:
|
02/25/2013
|
Publication #:
|
|
Pub Dt:
|
08/28/2014
| | | | |
Title:
|
CARRIER-LESS SILICON INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2015
|
Application #:
|
13778654
|
Filing Dt:
|
02/27/2013
|
Publication #:
|
|
Pub Dt:
|
08/28/2014
| | | | |
Title:
|
MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2015
|
Application #:
|
13778687
|
Filing Dt:
|
02/27/2013
|
Publication #:
|
|
Pub Dt:
|
08/28/2014
| | | | |
Title:
|
MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL
|
|
|
Patent #:
|
|
Issue Dt:
|
04/05/2016
|
Application #:
|
13781018
|
Filing Dt:
|
02/28/2013
|
Publication #:
|
|
Pub Dt:
|
06/26/2014
| | | | |
Title:
|
SYSTEMS AND METHODS OF FREQUENCY RESPONSE CORRECTION FOR CONSUMER ELECTRONIC DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2014
|
Application #:
|
13783553
|
Filing Dt:
|
03/04/2013
|
Publication #:
|
|
Pub Dt:
|
07/11/2013
| | | | |
Title:
|
3D IC METHOD AND DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13789594
|
Filing Dt:
|
03/07/2013
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
Auto-Focus Camera Module with MEMS Closed Loop Compensator
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
13789603
|
Filing Dt:
|
03/07/2013
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
Auto-Focus Camera Module with MEMS Capacitance Estimator
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
13789608
|
Filing Dt:
|
03/07/2013
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
Auto-Focus Camera Module with MEMS Distance Measurement
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2015
|
Application #:
|
13791488
|
Filing Dt:
|
03/08/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
OBJECT-ORIENTED AUDIO STREAMING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2016
|
Application #:
|
13792132
|
Filing Dt:
|
03/10/2013
|
Publication #:
|
|
Pub Dt:
|
10/10/2013
| | | | |
Title:
|
Miniature Camera Module with MEMS-Actuated Autofocus
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
13792521
|
Filing Dt:
|
03/11/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
13795229
|
Filing Dt:
|
03/12/2013
|
Publication #:
|
|
Pub Dt:
|
05/28/2015
| | | | |
Title:
|
SYSTEM AND METHOD FOR TRANSMITTING DIGITAL MULTIMEDIA DATA WITH ANALOG BROADCAST DATA
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2016
|
Application #:
|
13795756
|
Filing Dt:
|
03/12/2013
|
Publication #:
|
|
Pub Dt:
|
02/06/2014
| | | | |
Title:
|
BVA INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13795811
|
Filing Dt:
|
03/12/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
13797355
|
Filing Dt:
|
03/12/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2015
|
Application #:
|
13797540
|
Filing Dt:
|
03/12/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
CAPACITORS USING POROUS ALUMINA STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/06/2015
|
Application #:
|
13800313
|
Filing Dt:
|
03/13/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
MICROELECTRONIC ELEMENTS WITH MASTER/SLAVE CONFIGURABILITY
|
|
|
Patent #:
|
|
Issue Dt:
|
12/30/2014
|
Application #:
|
13802994
|
Filing Dt:
|
03/14/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
EQUALIZER FOR AM IN-BAND ON-CHANNEL RADIO RECEIVERS THAT DOES NOT REQUIRE ANALOG SIGNAL BANDWIDTH INFORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2014
|
Application #:
|
13819652
|
Filing Dt:
|
02/27/2013
|
Publication #:
|
|
Pub Dt:
|
06/20/2013
| | | | |
Title:
|
CAMERA MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/11/2014
|
Application #:
|
13828938
|
Filing Dt:
|
03/14/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/27/2016
|
Application #:
|
13830279
|
Filing Dt:
|
03/14/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
LOW COST INTERPOSER AND METHOD OF FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/13/2014
|
Application #:
|
13833278
|
Filing Dt:
|
03/15/2013
|
Title:
|
IN-PACKAGE FLY-BY SIGNALING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2016
|
Application #:
|
13834743
|
Filing Dt:
|
03/15/2013
|
Title:
|
AUDIO DEPTH DYNAMIC RANGE ENHANCEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2015
|
Application #:
|
13835011
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF IN-BAND ON-CHANNEL RADIO SIGNALS INCLUDING COMPLEMENTARY LOW DENSITY PARITY CHECK CODING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13837724
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
MANUFACTURE OF FACE-DOWN MICROELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2016
|
Application #:
|
13838210
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
10/17/2013
| | | | |
Title:
|
THERMAL DESPACE COMPENSATION SYSTEMS AND METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2017
|
Application #:
|
13838697
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
01/16/2014
| | | | |
Title:
|
LOUDNESS CONTROL WITH NOISE DETECTION AND LOUDNESS DROP DETECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
|
Application #:
|
13839402
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
02/27/2014
| | | | |
Title:
|
CO-SUPPORT SYSTEM AND MICROELECTRONIC ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2014
|
Application #:
|
13840353
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
02/27/2014
| | | | |
Title:
|
CO-SUPPORT COMPONENT AND MICROELECTRONIC ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2014
|
Application #:
|
13840542
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
02/27/2014
| | | | |
Title:
|
CO-SUPPORT MODULE AND MICROELECTRONIC ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2016
|
Application #:
|
13840576
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
CAMERA MODULES WITH INERTIAL SENSORS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2016
|
Application #:
|
13841052
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
04/24/2014
| | | | |
Title:
|
CO-SUPPORT CIRCUIT PANEL AND MICROELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2016
|
Application #:
|
13842832
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
10/24/2013
| | | | |
Title:
|
MEMS SHOCK CUSHION SPRING SYSTEMS AND METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13843107
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
10/24/2013
| | | | |
Title:
|
MINIATURE MEMS ACTUATOR ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2014
|
Application #:
|
13843817
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
08/22/2013
| | | | |
Title:
|
ARCUATE MOTION CONTROL IN ELECTROSTATIC ACTUATORS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2015
|
Application #:
|
13843956
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
System And Method For Recovering Audio PDU Transport Elements In Digital Radio Broadcast Receiver
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/2015
|
Application #:
|
13844096
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
Signal Artifact Detection and Elimination for Audio Output
|
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Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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13844140
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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08/22/2013
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Title:
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MEMS SNUBBER SYSTEMS AND METHODS
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Patent #:
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Issue Dt:
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04/14/2015
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Application #:
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13847269
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Filing Dt:
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03/19/2013
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Title:
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STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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13852322
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Filing Dt:
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03/28/2013
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Publication #:
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Pub Dt:
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08/22/2013
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Title:
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STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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13853268
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Filing Dt:
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03/29/2013
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Publication #:
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Pub Dt:
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11/07/2013
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Title:
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MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
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|
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Patent #:
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Issue Dt:
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07/19/2016
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Application #:
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13858815
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Filing Dt:
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04/08/2013
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Publication #:
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Pub Dt:
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10/09/2014
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Title:
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DIRECTIONAL BASED AUDIO RESPONSE TO AN EXTERNAL ENVIRONMENT EMERGENCY SIGNAL
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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13859271
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Filing Dt:
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04/09/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Title:
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STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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13862036
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Filing Dt:
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04/12/2013
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
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Patent #:
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Issue Dt:
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02/21/2017
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Application #:
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13867770
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Filing Dt:
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04/22/2013
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Publication #:
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Pub Dt:
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11/07/2013
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Title:
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CONTROL DEVICE, STORAGE DEVICE, AND STORAGE CONTROL METHOD
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13867928
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Filing Dt:
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04/22/2013
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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ROOM TEMPERATURE METAL DIRECT BONDING
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Patent #:
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Issue Dt:
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04/14/2015
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Application #:
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13868884
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Filing Dt:
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04/23/2013
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Publication #:
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Pub Dt:
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10/23/2014
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Title:
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RETENTION OPTIMIZED MEMORY DEVICE USING PREDICTIVE DATA INVERSION
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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13888349
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Filing Dt:
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05/06/2013
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Publication #:
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Pub Dt:
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11/07/2013
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Title:
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MEMS Auto Focus Miniature Camera Module with Fixed and Movable Lens Groups
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|
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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13897956
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Filing Dt:
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05/20/2013
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Publication #:
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Pub Dt:
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11/20/2014
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Title:
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METAL PVD-FREE CONDUCTING STRUCTURES
|
|
|
Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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13898952
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Filing Dt:
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05/21/2013
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Title:
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RECONFIGURABLE POP
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13901520
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Filing Dt:
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05/23/2013
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Publication #:
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Pub Dt:
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02/20/2014
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Title:
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ON-CHIP IMPEDANCE NETWORK WITH DIGITAL COARSE AND ANALOG FINE TUNING
|
|
|
Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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13905879
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Filing Dt:
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05/30/2013
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Publication #:
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Pub Dt:
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10/10/2013
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Title:
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BROADCAST EQUIPMENT COMMUNICATION PROTOCOL
|
|
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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13906214
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Filing Dt:
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05/30/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Title:
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OBJECT-BASED AUDIO SYSTEM USING VECTOR BASE AMPLITUDE PANNING
|
|
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Patent #:
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Issue Dt:
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09/23/2014
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Application #:
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13908902
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Filing Dt:
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06/03/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Title:
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HIGH YIELD SUBSTRATE ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
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11/11/2014
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Application #:
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13911555
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Filing Dt:
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06/06/2013
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Publication #:
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Pub Dt:
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12/26/2013
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Title:
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RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
|
|
|
Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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13913356
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Title:
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MEMS Fast Focus Camera Module
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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13914616
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Filing Dt:
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06/10/2013
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Publication #:
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Pub Dt:
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12/26/2013
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Title:
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METHOD OF MAKING A MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
|
|
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Patent #:
|
|
Issue Dt:
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06/02/2015
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Application #:
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13914896
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Filing Dt:
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06/11/2013
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Publication #:
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Pub Dt:
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10/17/2013
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Title:
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OFF-CHIP VIAS IN STACKED CHIPS
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|
|
Patent #:
|
|
Issue Dt:
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07/05/2016
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Application #:
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13922472
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Filing Dt:
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06/20/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Title:
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SYSTEM AND METHOD FOR ESTIMATING A REVERBERATION TIME
|
|
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Patent #:
|
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Issue Dt:
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07/19/2016
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Application #:
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13924002
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Filing Dt:
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06/21/2013
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Publication #:
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Pub Dt:
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12/25/2014
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Title:
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METHOD OF FORMING A RELIABLE MICROELECTRONIC ASSEMBLY
|
|
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Patent #:
|
|
Issue Dt:
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12/09/2014
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Application #:
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13926165
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Filing Dt:
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06/25/2013
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Publication #:
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Pub Dt:
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01/09/2014
| | | | |
Title:
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STACKABLE MOLDED MICROELECTRONIC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
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03/08/2016
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Application #:
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13929291
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Filing Dt:
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06/27/2013
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Publication #:
|
|
Pub Dt:
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10/31/2013
| | | | |
Title:
|
INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/09/2016
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Application #:
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13931975
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Filing Dt:
|
06/30/2013
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Publication #:
|
|
Pub Dt:
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01/30/2014
| | | | |
Title:
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Camera Orientation Sensing Using Camera Module with MEMS AF Actuator
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2014
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Application #:
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13939725
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Filing Dt:
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07/11/2013
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Publication #:
|
|
Pub Dt:
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12/26/2013
| | | | |
Title:
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SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
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Application #:
|
13940582
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Filing Dt:
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07/12/2013
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Publication #:
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Pub Dt:
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11/14/2013
| | | | |
Title:
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MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2015
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Application #:
|
13942568
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Filing Dt:
|
07/15/2013
|
Publication #:
|
|
Pub Dt:
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01/15/2015
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES WITH STACK TERMINALS COUPLED BY CONNECTORS EXTENDING THROUGH ENCAPSULATION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2015
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Application #:
|
13942602
|
Filing Dt:
|
07/15/2013
|
Publication #:
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Pub Dt:
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01/15/2015
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES HAVING REINFORCING COLLARS ON CONNECTORS EXTENDING THROUGH ENCAPSULATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/04/2015
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Application #:
|
13947062
|
Filing Dt:
|
07/20/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
Continuous Capacitance Measurement for MEMS-Actuated Movement of an Optical Component within an Auto-Focus Camera Module
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/2014
|
Application #:
|
13950912
|
Filing Dt:
|
07/25/2013
|
Publication #:
|
|
Pub Dt:
|
11/21/2013
| | | | |
Title:
|
DESKEWED MULTI-DIE PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
13954455
|
Filing Dt:
|
07/30/2013
|
Publication #:
|
|
Pub Dt:
|
11/28/2013
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2017
|
Application #:
|
13961217
|
Filing Dt:
|
08/07/2013
|
Publication #:
|
|
Pub Dt:
|
02/12/2015
| | | | |
Title:
|
MICRO MECHANICAL ANCHOR FOR 3D ARCHITECTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2015
|
Application #:
|
13961344
|
Filing Dt:
|
08/07/2013
|
Publication #:
|
|
Pub Dt:
|
02/12/2015
| | | | |
Title:
|
EMBEDDED PACKAGING WITH PREFORMED VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2017
|
Application #:
|
13962332
|
Filing Dt:
|
08/08/2013
|
Publication #:
|
|
Pub Dt:
|
02/12/2015
| | | | |
Title:
|
METHOD OF FORMING A WIRE BOND HAVING A FREE END
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2017
|
Application #:
|
13962349
|
Filing Dt:
|
08/08/2013
|
Publication #:
|
|
Pub Dt:
|
02/12/2015
| | | | |
Title:
|
ULTRA HIGH PERFORMANCE INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2016
|
Application #:
|
13964885
|
Filing Dt:
|
08/12/2013
|
Publication #:
|
|
Pub Dt:
|
02/13/2014
| | | | |
Title:
|
MULTI-CHANNEL AUDIO ENHANCEMENT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2016
|
Application #:
|
13966636
|
Filing Dt:
|
08/14/2013
|
Publication #:
|
|
Pub Dt:
|
12/12/2013
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13970028
|
Filing Dt:
|
08/19/2013
|
Publication #:
|
|
Pub Dt:
|
12/12/2013
| | | | |
Title:
|
METHOD OF MAKING A STACKED MICROELECTRONIC PACKAGE
|
|