|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09735792
|
Filing Dt:
|
12/14/2000
|
Publication #:
|
|
Pub Dt:
|
10/04/2001
| | | | |
Title:
|
PRINTED WIRING BOARD, IC CARD MODULE USING THE SAME, AND METHOD FOR PRODUCING IC CARD MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09735980
|
Filing Dt:
|
12/13/2000
|
Title:
|
METHOD FOR INCREASING TRACE ROWS OF A BALL GRID ARRAY
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2005
|
Application #:
|
09747143
|
Filing Dt:
|
12/22/2000
|
Publication #:
|
|
Pub Dt:
|
06/07/2001
| | | | |
Title:
|
SYSTEM AND METHOD FOR MITIGATING INTERMITTENT INTERRUPTIONS IN AN AUDIO RADIO BROADCAST SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09748140
|
Filing Dt:
|
12/27/2000
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
SEMICONDUCTOR MEMORY DEVICE HAVING A MULTI-LAYER INTERCONNECTION STRUCTURE SUITABLE FOR MERGING WITH LOGIC
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09750214
|
Filing Dt:
|
12/27/2000
|
Title:
|
Asynchronous memory self time scheme
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09750759
|
Filing Dt:
|
01/02/2001
|
Publication #:
|
|
Pub Dt:
|
01/17/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/2004
|
Application #:
|
09751979
|
Filing Dt:
|
12/29/2000
|
Publication #:
|
|
Pub Dt:
|
07/19/2001
| | | | |
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SIMULTANEOUS FORMATION OF VIA HOLE REACHING METAL WIRING AND CONCAVE GROOVE IN INTERLAYER FILM AND SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURED WITH THE MANUFACTURING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09752802
|
Filing Dt:
|
12/28/2000
|
Publication #:
|
|
Pub Dt:
|
05/17/2001
| | | | |
Title:
|
THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/07/2002
|
Application #:
|
09753561
|
Filing Dt:
|
01/04/2001
|
Publication #:
|
|
Pub Dt:
|
05/10/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2003
|
Application #:
|
09757242
|
Filing Dt:
|
01/08/2001
|
Publication #:
|
|
Pub Dt:
|
06/07/2001
| | | | |
Title:
|
BIRM AND GAS ESCAPE FOR NON-CONTACT WAFER HOLDER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09757897
|
Filing Dt:
|
01/10/2001
|
Publication #:
|
|
Pub Dt:
|
05/31/2001
| | | | |
Title:
|
MICROELECTRONIC CONNECTIONS WITH LIQUID CONDUCTIVE ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2003
|
Application #:
|
09758906
|
Filing Dt:
|
01/11/2001
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
Title:
|
PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2002
|
Application #:
|
09764590
|
Filing Dt:
|
01/17/2001
|
Title:
|
Employing an acidic liquid and an abrasive surface to polish a semiconductor topography
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2002
|
Application #:
|
09765030
|
Filing Dt:
|
01/17/2001
|
Publication #:
|
|
Pub Dt:
|
07/18/2002
| | | | |
Title:
|
CONDUCTIVE ADHESIVE INTERCONNECTION WITH INSULATING POLYMER CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/07/2003
|
Application #:
|
09766645
|
Filing Dt:
|
01/23/2001
|
Publication #:
|
|
Pub Dt:
|
09/27/2001
| | | | |
Title:
|
METHOD OF FABRICATING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A CONNECTION BETWEEN A SEMICONDUCTOR REGION AND ELECTRICAL WIRING METAL VIA A TITANIUM SILICIDE LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2005
|
Application #:
|
09766814
|
Filing Dt:
|
01/22/2001
|
Publication #:
|
|
Pub Dt:
|
06/06/2002
| | | | |
Title:
|
MICROELECTRONIC PACKAGES HAVING DEFORMED BONDED LEADS AND METHODS THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2005
|
Application #:
|
09768372
|
Filing Dt:
|
01/23/2001
|
Publication #:
|
|
Pub Dt:
|
06/28/2001
| | | | |
Title:
|
STRESS ACCOMMODATION IN ELECTRONIC DEVICE INTERCONNECT TECHNOLOGY FOR MILLIMETER CONTACT LOCATIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09768908
|
Filing Dt:
|
01/23/2001
|
Publication #:
|
|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
Single-Port multi-bank memory system having read and write buffers and method of operating same
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
09771412
|
Filing Dt:
|
01/26/2001
|
Publication #:
|
|
Pub Dt:
|
12/06/2001
| | | | |
Title:
|
MICROELECTRONICS COMPONENT WITH RIGID INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09771548
|
Filing Dt:
|
01/30/2001
|
Publication #:
|
|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
Resin-molded semicondutor device, method for manufacturing the same, and leadframe
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09772434
|
Filing Dt:
|
01/29/2001
|
Publication #:
|
|
Pub Dt:
|
12/20/2001
| | | | |
Title:
|
REDUCED TOPOGRAPHY DRAM CELL FABRICATED USING A MODIFIED LOGIC PROCESS AND METHOD FOR OPERATING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2004
|
Application #:
|
09776356
|
Filing Dt:
|
02/02/2001
|
Publication #:
|
|
Pub Dt:
|
07/05/2001
| | | | |
Title:
|
STACKED MICROELECTRONIC ASSEMBLY AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2003
|
Application #:
|
09777781
|
Filing Dt:
|
02/06/2001
|
Publication #:
|
|
Pub Dt:
|
07/05/2001
| | | | |
Title:
|
COMPONENTS WITH RELEASABLE LEADS AND METHODS OF MAKING RELEASABLE LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2002
|
Application #:
|
09777782
|
Filing Dt:
|
02/06/2001
|
Publication #:
|
|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
COMPLIANT MICROELECTRONIC ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
|
Application #:
|
09778702
|
Filing Dt:
|
02/07/2001
|
Publication #:
|
|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
09778849
|
Filing Dt:
|
02/08/2001
|
Publication #:
|
|
Pub Dt:
|
10/10/2002
| | | | |
Title:
|
METHOD FOR PROCESSING A DIGITAL IMAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2004
|
Application #:
|
09779117
|
Filing Dt:
|
02/08/2001
|
Publication #:
|
|
Pub Dt:
|
08/09/2001
| | | | |
Title:
|
ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2005
|
Application #:
|
09779123
|
Filing Dt:
|
02/07/2001
|
Publication #:
|
|
Pub Dt:
|
08/08/2002
| | | | |
Title:
|
PLANARIZED SEMICONDUCTOR INTERCONNECT TOPOGRAPHY AND METHOD FOR POLISHING A METAL LAYER TO FORM INTERCONNECT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09781252
|
Filing Dt:
|
02/13/2001
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09781866
|
Filing Dt:
|
02/12/2001
|
Title:
|
LAYOUT OF VDD AND VSS BALLS IN A FOUR LAYER PBGA
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
09785104
|
Filing Dt:
|
02/16/2001
|
Publication #:
|
|
Pub Dt:
|
07/26/2001
| | | | |
Title:
|
MICROELECTRONIC ELEMENTS WITH DEFORMABLE LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2005
|
Application #:
|
09787526
|
Filing Dt:
|
12/30/2002
|
Title:
|
SEMICONDUCTOR DEVICE PROVIDED WITH REWIRING LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2002
|
Application #:
|
09791245
|
Filing Dt:
|
02/22/2001
|
Publication #:
|
|
Pub Dt:
|
07/12/2001
| | | | |
Title:
|
Microelectronic mounting with multiple lead deformation using restraining straps
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09791800
|
Filing Dt:
|
02/26/2001
|
Publication #:
|
|
Pub Dt:
|
07/26/2001
| | | | |
Title:
|
HIGH SPEED AND LOW PARASITIC CAPACITANCE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09791977
|
Filing Dt:
|
02/22/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS, AND METHODS OF MANUFACTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/24/2002
|
Application #:
|
09792311
|
Filing Dt:
|
02/22/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2003
|
Application #:
|
09795680
|
Filing Dt:
|
02/27/2001
|
Title:
|
SEMICONDUCTOR BLOCKING LAYER FOR PREVENTING UV RADIATION DAMAGE TO MOS GATE OXIDES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
09808461
|
Filing Dt:
|
03/14/2001
|
Publication #:
|
|
Pub Dt:
|
09/19/2002
| | | | |
Title:
|
COMPONENTS AND METHODS WITH NESTED LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2005
|
Application #:
|
09811401
|
Filing Dt:
|
03/20/2001
|
Publication #:
|
|
Pub Dt:
|
05/30/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE-MOUNTED STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09811803
|
Filing Dt:
|
03/19/2001
|
Publication #:
|
|
Pub Dt:
|
12/06/2001
| | | | |
Title:
|
METHODS OF MAKING MICROELECTRONIC ASSEMBLIES USING COMPRESSED RESILIENT LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2002
|
Application #:
|
09818566
|
Filing Dt:
|
03/28/2001
|
Publication #:
|
|
Pub Dt:
|
09/13/2001
| | | | |
Title:
|
PROCESS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2003
|
Application #:
|
09818917
|
Filing Dt:
|
03/28/2001
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2004
|
Application #:
|
09822335
|
Filing Dt:
|
04/02/2001
|
Publication #:
|
|
Pub Dt:
|
09/06/2001
| | | | |
Title:
|
SELF ALIGNED SYMMETRIC INTRINSIC PROCESS AND DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2005
|
Application #:
|
09823750
|
Filing Dt:
|
04/03/2001
|
Publication #:
|
|
Pub Dt:
|
04/04/2002
| | | | |
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2005
|
Application #:
|
09823751
|
Filing Dt:
|
04/03/2001
|
Publication #:
|
|
Pub Dt:
|
03/21/2002
| | | | |
Title:
|
PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09834077
|
Filing Dt:
|
04/12/2001
|
Publication #:
|
|
Pub Dt:
|
09/13/2001
| | | | |
Title:
|
METHOD AND APPARATUS FOR AM DIGITAL BROADCASTING
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09835412
|
Filing Dt:
|
04/17/2001
|
Publication #:
|
|
Pub Dt:
|
10/11/2001
| | | | |
Title:
|
SUBSTRATE-CLEANING METHOD AND SUBSTRATE-CLEANING SOLUTION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2003
|
Application #:
|
09837816
|
Filing Dt:
|
04/17/2001
|
Title:
|
FOUR CURRENT TRANSISTOR TEMPERATURE SENSOR AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
09838484
|
Filing Dt:
|
04/19/2001
|
Publication #:
|
|
Pub Dt:
|
03/21/2002
| | | | |
Title:
|
SYSTEM FOR MANAGING DATA OBJECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2011
|
Application #:
|
09839451
|
Filing Dt:
|
04/20/2001
|
Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Title:
|
SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
|
|
|
Patent #:
|
|
Issue Dt:
|
07/13/2004
|
Application #:
|
09844530
|
Filing Dt:
|
04/27/2001
|
Title:
|
BALL ASSIGNMENT FOR BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/07/2003
|
Application #:
|
09846093
|
Filing Dt:
|
04/30/2001
|
Publication #:
|
|
Pub Dt:
|
10/04/2001
| | | | |
Title:
|
METHOD AND APPARATUS FOR COMPLETELY HIDING REFRESH OPERATIONS IN A DRAM DEVICE USING CLOCK DIVISION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2003
|
Application #:
|
09848387
|
Filing Dt:
|
05/03/2001
|
Publication #:
|
|
Pub Dt:
|
12/27/2001
| | | | |
Title:
|
METHOD OF MAKING A MICROELECTRONIC ASSEMBLY WITH MULTIPLE LEAD DEFORMATION USING DIFFERENTIAL THERMAL EXPANSION/CONTRACTION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/04/2004
|
Application #:
|
09848800
|
Filing Dt:
|
05/04/2001
|
Publication #:
|
|
Pub Dt:
|
04/11/2002
| | | | |
Title:
|
TEST INTERFACE FOR VERIFICATION OF HIGH SPEED EMBEDDED SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (SDRAM) CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
|
Application #:
|
09850973
|
Filing Dt:
|
05/08/2001
|
Publication #:
|
|
Pub Dt:
|
01/03/2002
| | | | |
Title:
|
SEMICONDUCTOR CHIP PACKAGE WITH INTERCONNECT STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2009
|
Application #:
|
09851313
|
Filing Dt:
|
05/09/2001
|
Publication #:
|
|
Pub Dt:
|
12/13/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER HAVING A MULTI-LAYERED INSULATION FILM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09852793
|
Filing Dt:
|
05/11/2001
|
Publication #:
|
|
Pub Dt:
|
10/25/2001
| | | | |
Title:
|
METHOD OF FORMING A CMOS STRUCTURE HAVING GATE INSULATION FILMS OF DIFFERENT THICKNESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
|
09854269
|
Filing Dt:
|
05/11/2001
|
Publication #:
|
|
Pub Dt:
|
09/13/2001
| | | | |
Title:
|
MICROELECTRONIC PACKAGES WITH ELONGATED SOLDER INTERCONNECTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09858455
|
Filing Dt:
|
05/17/2001
|
Publication #:
|
|
Pub Dt:
|
06/20/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD OF MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
09858770
|
Filing Dt:
|
05/16/2001
|
Publication #:
|
|
Pub Dt:
|
06/20/2002
| | | | |
Title:
|
MICROELECTRONIC PACKAGING METHODS AND COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09859268
|
Filing Dt:
|
05/16/2001
|
Title:
|
SELF-TIME SCHEME TO REDUCE CYCLE TIME FOR MEMORIES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2003
|
Application #:
|
09860246
|
Filing Dt:
|
05/18/2001
|
Publication #:
|
|
Pub Dt:
|
09/20/2001
| | | | |
Title:
|
METHOD AND APPARATUS FOR REDUCTION OF FM INTERFERENCE FOR FM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09864255
|
Filing Dt:
|
05/25/2001
|
Publication #:
|
|
Pub Dt:
|
12/06/2001
| | | | |
Title:
|
WIRING STRUCTURE OF SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09865686
|
Filing Dt:
|
11/21/2000
|
Title:
|
METHODS OF MAKING BONDABLE CONTACTS AND A TOOL FOR MAKING SUCH CONTACTS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/14/2004
|
Application #:
|
09869274
|
Filing Dt:
|
06/26/2001
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING BUMP ELECTRODES FOR SIGNAL OR POWER ONLY, AND TESTING PADS THAT ARE NOT COUPLED TO BUMP ELECTRODES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2004
|
Application #:
|
09874606
|
Filing Dt:
|
06/05/2001
|
Publication #:
|
|
Pub Dt:
|
10/04/2001
| | | | |
Title:
|
PAD METALLIZATION OVER ACTIVE CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2003
|
Application #:
|
09875383
|
Filing Dt:
|
06/06/2001
|
Publication #:
|
|
Pub Dt:
|
09/27/2001
| | | | |
Title:
|
ENCAPSULATION OF MICROELECTRONIC ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/24/2002
|
Application #:
|
09876888
|
Filing Dt:
|
06/06/2001
|
Publication #:
|
|
Pub Dt:
|
01/31/2002
| | | | |
Title:
|
THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09879082
|
Filing Dt:
|
06/13/2001
|
Publication #:
|
|
Pub Dt:
|
08/15/2002
| | | | |
Title:
|
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2005
|
Application #:
|
09883370
|
Filing Dt:
|
06/19/2001
|
Publication #:
|
|
Pub Dt:
|
12/27/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
09885684
|
Filing Dt:
|
06/20/2001
|
Publication #:
|
|
Pub Dt:
|
01/24/2002
| | | | |
Title:
|
TRANSFERABLE RESILIENT ELEMENT FOR PACKAGING OF A SEMICONDUCTOR CHIP AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09887322
|
Filing Dt:
|
06/25/2001
|
Publication #:
|
|
Pub Dt:
|
06/27/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
|
09891449
|
Filing Dt:
|
06/26/2001
|
Publication #:
|
|
Pub Dt:
|
01/31/2002
| | | | |
Title:
|
INTEGRATED CIRCUIT WITH FLASH MEMORY INCLUDING DEDICATED FLASH BUS AND FLASH BRIDGE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2007
|
Application #:
|
09891798
|
Filing Dt:
|
06/26/2001
|
Publication #:
|
|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
ESTIMATING EB/NT IN A CDMA SYSTEM USING POWER CONTROL BITS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09893926
|
Filing Dt:
|
06/28/2001
|
Publication #:
|
|
Pub Dt:
|
12/06/2001
| | | | |
Title:
|
FABRICATION PROCESS FOR A SEMICONDUCTOR DEVICE WITH DAMASCENE INTERCONNECT LINES OF THE SAME LEVEL SEPARATED BY INSULATORS WITH DIFFERENT DIELECTRIC CONSTANTS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09894718
|
Filing Dt:
|
06/27/2001
|
Title:
|
TAPE DESIGN TO REDUCE WARPAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
09903580
|
Filing Dt:
|
07/13/2001
|
Publication #:
|
|
Pub Dt:
|
01/17/2002
| | | | |
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09904591
|
Filing Dt:
|
07/16/2001
|
Publication #:
|
|
Pub Dt:
|
01/17/2002
| | | | |
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
09904700
|
Filing Dt:
|
07/13/2001
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
ARTICLE HOLDERS AND ARTICLE POSITIONING METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/09/2004
|
Application #:
|
09906602
|
Filing Dt:
|
07/17/2001
|
Publication #:
|
|
Pub Dt:
|
01/31/2002
| | | | |
Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2006
|
Application #:
|
09907036
|
Filing Dt:
|
07/17/2001
|
Publication #:
|
|
Pub Dt:
|
01/17/2002
| | | | |
Title:
|
SOLID STATE IMAGE PICK-UP DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/20/2004
|
Application #:
|
09916554
|
Filing Dt:
|
07/27/2001
|
Publication #:
|
|
Pub Dt:
|
06/27/2002
| | | | |
Title:
|
METHOD OF MAKING A MICROELECTRONIC PACKAGE INCLUDING A COMPONENT HAVING CONDUCTIVE ELEMENTS ON A TOP SIDE AND A BOTTOM SIDE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2003
|
Application #:
|
09919284
|
Filing Dt:
|
07/31/2001
|
Title:
|
PBGA ELECTRICAL NOISE ISOLATION OF SIGNAL TRACES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09920499
|
Filing Dt:
|
08/01/2001
|
Publication #:
|
|
Pub Dt:
|
07/04/2002
| | | | |
Title:
|
Wet etch process and composition for forming openings in a polymer substrate
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2002
|
Application #:
|
09922069
|
Filing Dt:
|
08/02/2001
|
Publication #:
|
|
Pub Dt:
|
02/14/2002
| | | | |
Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2003
|
Application #:
|
09922205
|
Filing Dt:
|
08/02/2001
|
Publication #:
|
|
Pub Dt:
|
02/07/2002
| | | | |
Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2006
|
Application #:
|
09922770
|
Filing Dt:
|
08/07/2001
|
Publication #:
|
|
Pub Dt:
|
03/07/2002
| | | | |
Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES & PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2003
|
Application #:
|
09923406
|
Filing Dt:
|
08/08/2001
|
Publication #:
|
|
Pub Dt:
|
02/21/2002
| | | | |
Title:
|
METHOD OF FORMING A CAPACITOR IN A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING A METAL SILICON NITRIDE LAYER TO PROTECT AN UNDERLYING METAL SILICIDE LAYER FROM OXIDATION DURING SUBSEQUENT PROCESSING STEPS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09923712
|
Filing Dt:
|
08/07/2001
|
Publication #:
|
|
Pub Dt:
|
11/29/2001
| | | | |
Title:
|
METHOD FOR CREATING A DIE SHRINK INSENSITIVE SEMICONDUCTOR PACKAGE AND COMPONENT THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09927635
|
Filing Dt:
|
08/13/2001
|
Publication #:
|
|
Pub Dt:
|
03/07/2002
| | | | |
Title:
|
Method for forming a semiconuctor device having plurality of circuits parts
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
09931891
|
Filing Dt:
|
08/20/2001
|
Publication #:
|
|
Pub Dt:
|
01/24/2002
| | | | |
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2006
|
Application #:
|
09937580
|
Filing Dt:
|
01/04/2002
|
Title:
|
METHOD AND SYSTEM FOR SUPER RESOLUTION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2005
|
Application #:
|
09941447
|
Filing Dt:
|
08/28/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
FABRICATION OF SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2005
|
Application #:
|
09942363
|
Filing Dt:
|
08/29/2001
|
Publication #:
|
|
Pub Dt:
|
04/11/2002
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES WITH COMPOSITE CONDUCTIVE ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2008
|
Application #:
|
09942386
|
Filing Dt:
|
08/30/2001
|
Publication #:
|
|
Pub Dt:
|
01/10/2002
| | | | |
Title:
|
COMPONENTS WITH CONDUCTIVE SOLDER MASK LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09942825
|
Filing Dt:
|
08/31/2001
|
Publication #:
|
|
Pub Dt:
|
01/17/2002
| | | | |
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT AND NONVOLATILE MEMORY ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09942902
|
Filing Dt:
|
08/31/2001
|
Publication #:
|
|
Pub Dt:
|
09/12/2002
| | | | |
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT AND NONVOLATILE MEMORY ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2002
|
Application #:
|
09944964
|
Filing Dt:
|
08/31/2001
|
Title:
|
ENHANCED LAMINATE FLIPCHIP PACKAGE USING A HIGH CTE HEATSPREADER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2004
|
Application #:
|
09945775
|
Filing Dt:
|
09/04/2001
|
Publication #:
|
|
Pub Dt:
|
01/31/2002
| | | | |
Title:
|
SELECTIVE REMOVAL OF DIELECTRIC MATERIALS AND PLATING PROCESS USING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2003
|
Application #:
|
09946363
|
Filing Dt:
|
09/06/2001
|
Publication #:
|
|
Pub Dt:
|
03/07/2002
| | | | |
Title:
|
SEMICONDUCTOR DEVICE HAVING A PLURALITY OF STACKED SEMICONDUCTOR CHIPS ON A WIRING BOARD
|
|