|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/27/2004
|
Application #:
|
10185317
|
Filing Dt:
|
06/28/2002
|
|
Title:
|
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING A DISPOSABLE HARDMASK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2005
|
Application #:
|
10189014
|
Filing Dt:
|
07/05/2002
|
|
Publication #:
|
|
Pub Dt:
|
11/07/2002
| | | | |
|
Title:
|
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2004
|
Application #:
|
10192657
|
Filing Dt:
|
07/11/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING OFFSET INSULATION FILM FORMED ON INSULATION FILM, AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10192702
|
Filing Dt:
|
07/11/2002
|
|
Publication #:
|
|
Pub Dt:
|
11/21/2002
| | | | |
|
Title:
|
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2004
|
Application #:
|
10197335
|
Filing Dt:
|
07/17/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/22/2004
| | | | |
|
Title:
|
METHOD AND PACKAGING STRUCTURE FOR OPTIMIZING WARPAGE OF FLIP CHIP ORGANIC PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/21/2005
|
Application #:
|
10199109
|
Filing Dt:
|
07/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/23/2003
| | | | |
|
Title:
|
RESIN ENCAPSULATION SEMICONDUCTOR DEVICE UTILIZING GROOVED LEADS AND DIE PAD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
|
Application #:
|
10199592
|
Filing Dt:
|
07/19/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
10200815
|
Filing Dt:
|
07/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/05/2002
| | | | |
|
Title:
|
GRADED METALLIC LEADS FOR CONNECTION TO MICROELECTRONIC ELEMENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2004
|
Application #:
|
10200941
|
Filing Dt:
|
07/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/05/2002
| | | | |
|
Title:
|
ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2004
|
Application #:
|
10205635
|
Filing Dt:
|
07/25/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/05/2002
| | | | |
|
Title:
|
COMPLIANT SEMICONDUCTOR PACKAGE WITH ANISOTROPIC CONDUCTIVE MATERIAL INTERCONNECTS AND METHODS THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2003
|
Application #:
|
10209483
|
Filing Dt:
|
07/31/2002
|
|
Title:
|
SELF-TIME SCHEME TO REDUCE CYCLE TIME FOR MEMORIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2007
|
Application #:
|
10210143
|
Filing Dt:
|
07/31/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/05/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR RECEIVING A DIGITAL AUDIO BROADCASTING SIGNAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10210160
|
Filing Dt:
|
08/01/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
|
Title:
|
HIGH-FREQUENCY CHIP PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/25/2007
|
Application #:
|
10210811
|
Filing Dt:
|
08/01/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/12/2002
| | | | |
|
Title:
|
METHOD OF FABRICATING SEMICONDUCTOR CHIP ASSEMBLIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10216722
|
Filing Dt:
|
08/13/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/20/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING A CAPACITANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2003
|
Application #:
|
10217769
|
Filing Dt:
|
08/13/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/19/2002
| | | | |
|
Title:
|
MEMORY CONTROLLER WITH ARBITRATION AMONG SEVERAL STROBE REQUESTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/25/2005
|
Application #:
|
10219902
|
Filing Dt:
|
08/15/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/26/2002
| | | | |
|
Title:
|
MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2005
|
Application #:
|
10235102
|
Filing Dt:
|
09/05/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
|
Title:
|
MICROELECTRONIC ASSEMBLY FORMATION WITH RELEASABLE LEADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2004
|
Application #:
|
10236442
|
Filing Dt:
|
09/06/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/05/2004
| | | | |
|
Title:
|
MICROELECTRONIC ADAPTORS, ASSEMBLIES AND METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2005
|
Application #:
|
10247594
|
Filing Dt:
|
09/19/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
|
Title:
|
MEMORY I/O BUFFER USING SHARED READ/WRITE CIRCUITRY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/20/2004
|
Application #:
|
10251753
|
Filing Dt:
|
09/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING THIN ELECTRODE LAYE ADJACENT GATE INSULATOR AND METHOD OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
10253588
|
Filing Dt:
|
09/25/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
|
Title:
|
WAFER BONDING HERMETIC ENCAPSULATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
10254926
|
Filing Dt:
|
09/25/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
|
Title:
|
FORMING MICROELECTRONIC CONNECTION COMPONENTS BY ELECTROPHORETIC DEPOSITION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
10259396
|
Filing Dt:
|
09/30/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
|
Title:
|
FIELD-EFFECT TYPE SEMICONDUCTOR DEVICE FOR POWER AMPLIFIER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10261454
|
Filing Dt:
|
10/01/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
|
Title:
|
EFFICIENT CODING OF HIGH FREQUENCY SIGNAL INFORMATION IN A SIGNAL USING A LINEAR/NON-LINEAR PREDICTION MODEL BASED ON A LOW PASS BASEBAND
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2006
|
Application #:
|
10263909
|
Filing Dt:
|
10/03/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/08/2004
| | | | |
|
Title:
|
ELECTRONIC PACKAGE WITH FILLED BLINDS VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
|
Application #:
|
10265056
|
Filing Dt:
|
10/04/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/27/2003
| | | | |
|
Title:
|
ARTICLE HOLDERS WITH SENSORS DETECTING A TYPE OF ARTICLE HELD BY THE HOLDER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10267450
|
Filing Dt:
|
10/09/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/12/2003
| | | | |
|
Title:
|
STACKED PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2006
|
Application #:
|
10270318
|
Filing Dt:
|
10/15/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/26/2003
| | | | |
|
Title:
|
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2006
|
Application #:
|
10276776
|
Filing Dt:
|
11/19/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/19/2003
| | | | |
|
Title:
|
Semiconductor device and method of manufacturing the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2006
|
Application #:
|
10277498
|
Filing Dt:
|
10/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES AND PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2008
|
Application #:
|
10277821
|
Filing Dt:
|
10/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/13/2003
| | | | |
|
Title:
|
Semiconductor device with semiconductor layer having various thickness
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2005
|
Application #:
|
10278316
|
Filing Dt:
|
10/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/20/2003
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR RECOVERING SYMBOL TIMING OFFSET AND CARRIER FREQUENCY ERROR IN AN OFDM DIGITAL AUDIO BROADCAST SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10278465
|
Filing Dt:
|
10/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
|
Title:
|
JOINING SEMICONDUCTOR UNITS WITH BONDING MATERIAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2006
|
Application #:
|
10278687
|
Filing Dt:
|
10/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
PACKAGING INTEGRATED CIRCUITS WITH ADHESIVE POSTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10279363
|
Filing Dt:
|
10/23/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/27/2003
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR COMPLETELY HIDING REFRESH OPERATIONS IN A DRAM DEVICE USING CLOCK DIVISION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2007
|
Application #:
|
10281306
|
Filing Dt:
|
10/28/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/12/2006
|
Application #:
|
10281550
|
Filing Dt:
|
10/28/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2003
| | | | |
|
Title:
|
STACKED MICROELECTRONIC ASSEMBLIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2006
|
Application #:
|
10282044
|
Filing Dt:
|
10/29/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/03/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
10289736
|
Filing Dt:
|
11/07/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/13/2004
| | | | |
|
Title:
|
ASYNCHRONOUS INPUT DATA PATH TECHNIQUE FOR INCREASING SPEED AND REDUCING LATENCY IN INTEGRATED CIRCUIT DEVICES INCORPORATING DYNAMIC RANDOM ACCESS MEMORY (DRAM) ARRAYS AND EMBEDDED DRAM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
10290010
|
Filing Dt:
|
11/07/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/17/2003
| | | | |
|
Title:
|
FLEXIBLE LEAD STRUCTURES AND METHODS OF MAKING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/04/2004
|
Application #:
|
10294011
|
Filing Dt:
|
11/12/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/13/2004
| | | | |
|
Title:
|
FOLDED-FLEX BONDWIRE-LESS MULTICHIP POWER PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/03/2004
|
Application #:
|
10294712
|
Filing Dt:
|
11/15/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/10/2003
| | | | |
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
10295711
|
Filing Dt:
|
11/15/2002
|
|
Title:
|
GROUND PLANE ON 2 LAYER PBGA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10300427
|
Filing Dt:
|
11/20/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/10/2003
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR TEMPERATURE ADAPTIVE REFRESH IN 1T-SRAM COMPATIBLE MEMORY USING THE SUBTHRESHOLD CHARACTERISTICS OF MOSFET TRANSISTORS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2004
|
Application #:
|
10307450
|
Filing Dt:
|
12/02/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/26/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER FORMED BETWEEN ELECTRODE PORTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2005
|
Application #:
|
10308157
|
Filing Dt:
|
12/03/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
RAM HAVING DYNAMICALLY SWITCHABLE ACCESS MODES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10308310
|
Filing Dt:
|
12/03/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/03/2004
| | | | |
|
Title:
|
STIFFENER DESIGN
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2004
|
Application #:
|
10309238
|
Filing Dt:
|
12/04/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/31/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2008
|
Application #:
|
10310105
|
Filing Dt:
|
12/04/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/25/2003
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR FORWARD ERROR CORRECTION CODING FOR AN AM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10314498
|
Filing Dt:
|
12/06/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
|
Title:
|
STRUCTURE AND METHOD FOR LEAD FREE SOLDER ELECTRONIC PACKAGE INTERCONNECTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2003
|
Application #:
|
10318833
|
Filing Dt:
|
12/12/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2004
|
Application #:
|
10320362
|
Filing Dt:
|
12/17/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2004
|
Application #:
|
10320379
|
Filing Dt:
|
12/17/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
STACKED SEMICONDUCTOR CHIPS ATTACHED TO A WIRING BOARD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2004
|
Application #:
|
10320405
|
Filing Dt:
|
12/17/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/15/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10321058
|
Filing Dt:
|
12/17/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR AM DIGITAL AUDIO BROADCASTING WITH AMPLITUDE SCALED TERTIARY SUBCARRIERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/13/2004
|
Application #:
|
10321614
|
Filing Dt:
|
12/18/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/12/2003
| | | | |
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/10/2009
|
Application #:
|
10338914
|
Filing Dt:
|
01/09/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/04/2003
| | | | |
|
Title:
|
COMMUNICATION APPARATUS, METHOD AND PROGRAMS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2006
|
Application #:
|
10342764
|
Filing Dt:
|
01/15/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF FM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2004
|
Application #:
|
10342969
|
Filing Dt:
|
01/15/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/05/2003
| | | | |
|
Title:
|
METHODS OF MAKING ANISOTROPIC CONDUCTIVE ELEMENTS FOR USE IN MICROELECTRONIC PACKAGING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2005
|
Application #:
|
10342973
|
Filing Dt:
|
01/15/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING LIGHT SENSITIVE CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2007
|
Application #:
|
10345735
|
Filing Dt:
|
01/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
|
Title:
|
REDUCED GATE DELAY MULTIPLEXED INTERFACE AND OUTPUT BUFFER CIRCUIT FOR INTEGRATED CIRCUIT DEVICES INCORPORATING RANDOM ACCESS MEMORY ARRAYS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2004
|
Application #:
|
10345736
|
Filing Dt:
|
01/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
|
Title:
|
BITLINE REFERENCE VOLTAGE CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/22/2004
|
Application #:
|
10352607
|
Filing Dt:
|
01/27/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/07/2003
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE WITH A CAVITY AND A SEMICONDUCTOR INTEGRATED CIRCUIT BONDED TO A CONTACT PAD LOCATED IN THE CAVITY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
10353737
|
Filing Dt:
|
01/29/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/10/2003
| | | | |
|
Title:
|
METHOD OF ASSEMBLING A SEMICONDUCTOR CHIP PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2012
|
Application #:
|
10353819
|
Filing Dt:
|
01/29/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
|
Title:
|
METHOD FOR PROVIDING AND OBTAINING CONTENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
10355116
|
Filing Dt:
|
01/31/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
|
Application #:
|
10358141
|
Filing Dt:
|
02/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/31/2003
| | | | |
|
Title:
|
METHOD OF EPITAXIAL-LIKE WAFER BONDING AT LOW TEMPERATURE AND BONDED STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10358229
|
Filing Dt:
|
02/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/21/2003
| | | | |
|
Title:
|
CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
10358668
|
Filing Dt:
|
02/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
BANDGAP REFERENCE CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/08/2005
|
Application #:
|
10359608
|
Filing Dt:
|
02/07/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
METHOD FOR ROOM TEMPERATURE METAL DIRECT BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2004
|
Application #:
|
10366425
|
Filing Dt:
|
02/13/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
METHOD OF MAKING COMPONENTS WITH RELEASABLE LEADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2005
|
Application #:
|
10366886
|
Filing Dt:
|
02/14/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/19/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR DYNAMIC FILTER SELECTION IN RADIO RECEIVERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/24/2006
|
Application #:
|
10373484
|
Filing Dt:
|
02/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
|
Title:
|
COHERENT AM DEMODULATOR USING A WEIGHTED LSB/USB SUM FOR INTERFERENCE MITIGATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/23/2003
|
Application #:
|
10374562
|
Filing Dt:
|
02/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2003
| | | | |
|
Title:
|
DATA PATH DECODING TECHNIQUE FOR AN EMBEDDED MEMORY ARRAY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
10374956
|
Filing Dt:
|
02/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
DRAM CELL HAVING A CAPACITOR STRUCTURE FABRICATED PARTIALLY IN A CAVITY AND METHOD FOR OPERATING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2004
|
Application #:
|
10376694
|
Filing Dt:
|
03/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2003
| | | | |
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2009
|
Application #:
|
10377513
|
Filing Dt:
|
02/28/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/08/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR SYNCHRONIZED TRANSMISSION AND RECEPTION OF DATA IN A DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2004
|
Application #:
|
10377677
|
Filing Dt:
|
02/28/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR LENGTHENING THE DATA-RETENTION TIME OF A DRAM DEVICE IN STANDBY MODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2010
|
Application #:
|
10381216
|
Filing Dt:
|
09/02/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2005
| | | | |
|
Title:
|
PROCESSOR BUS ARRANGEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2007
|
Application #:
|
10385555
|
Filing Dt:
|
03/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
INTEGRATED CIRCUIT DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10387261
|
Filing Dt:
|
03/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/18/2003
| | | | |
|
Title:
|
PBGA ELECTRICAL NOISE ISOLATION OF SIGNAL TRACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10387504
|
Filing Dt:
|
03/14/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/02/2003
| | | | |
|
Title:
|
A SEMICONDUCTOR DEVICE INCLUDING AN INTERCONNECT HAVING COPPER AS A MAIN COMPONENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
10390603
|
Filing Dt:
|
03/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/27/2003
| | | | |
|
Title:
|
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2005
|
Application #:
|
10391315
|
Filing Dt:
|
03/18/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2004
| | | | |
|
Title:
|
NON-CONTIGUOUS MASKED REFRESH FOR AN INTEGRATED CIRCUIT MEMORY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2005
|
Application #:
|
10395078
|
Filing Dt:
|
03/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/18/2003
| | | | |
|
Title:
|
WIDE BAND ANTENNA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/06/2004
|
Application #:
|
10397065
|
Filing Dt:
|
03/25/2003
|
|
Title:
|
THERMAL AND MECHANICAL ATTACHMENT OF A HEATSPREADER TO A FLIP-CHIP INTEGRATED CIRCUIT STRUCTURE USING UNDERFILL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2005
|
Application #:
|
10402289
|
Filing Dt:
|
03/28/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
|
Title:
|
METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND THE RESULTANT ELECTRONIC PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10410929
|
Filing Dt:
|
04/09/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
|
Title:
|
ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO OPENINGS, AND STRUCTURES OBTAINED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2005
|
Application #:
|
10414516
|
Filing Dt:
|
04/15/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/21/2004
| | | | |
|
Title:
|
ROW REDUNDANCY MEMORY REPAIR SCHEME WITH SHIFT OT ELIMINATE TIMING PENALTY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2005
|
Application #:
|
10422942
|
Filing Dt:
|
04/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
|
10426764
|
Filing Dt:
|
04/30/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/09/2003
| | | | |
|
Title:
|
AUDIO BLEND METHOD AND APPARATUS FOR AM AND FM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2004
|
Application #:
|
10435805
|
Filing Dt:
|
05/12/2003
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGING THAT USES GUARD CONDUCTORS TO ISOLATE NOISE-SENSITIVE SIGNALS WITHIN THE PACKAGE SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10436591
|
Filing Dt:
|
05/12/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/09/2003
| | | | |
|
Title:
|
BALL GRID ARRAY MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2004
|
Application #:
|
10438847
|
Filing Dt:
|
05/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/30/2003
| | | | |
|
Title:
|
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10438887
|
Filing Dt:
|
05/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/06/2003
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10440099
|
Filing Dt:
|
05/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
|
Title:
|
METHOD OF ROOM TEMPERATURE COVALENT BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10444891
|
Filing Dt:
|
05/23/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
|
Title:
|
MEMORY IMPLEMENTATION FOR HANDLING INTEGRATED CIRCUIT FABRICATION FAULTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2005
|
Application #:
|
10448515
|
Filing Dt:
|
05/30/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
|
Title:
|
ASSEMBLIES HAVING STACKED SEMICONDUCTOR CHIPS AND METHODS OF MAKING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2008
|
Application #:
|
10451564
|
Filing Dt:
|
05/03/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/18/2007
| | | | |
|
Title:
|
PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
|
|
