|
|
Patent #:
|
|
Issue Dt:
|
03/14/2006
|
Application #:
|
10452333
|
Filing Dt:
|
06/02/2003
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES INCORPORATING INDUCTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10452874
|
Filing Dt:
|
06/02/2003
|
Publication #:
|
|
Pub Dt:
|
10/02/2003
| | | | |
Title:
|
DESIGNING A BALL ASSIGNMENT FOR A BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/2005
|
Application #:
|
10454029
|
Filing Dt:
|
06/04/2003
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
Title:
|
STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/2006
|
Application #:
|
10454258
|
Filing Dt:
|
06/03/2003
|
Publication #:
|
|
Pub Dt:
|
12/09/2004
| | | | |
Title:
|
SUBSTRATE ALIGNMENT METHOD AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10460418
|
Filing Dt:
|
06/13/2003
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10462576
|
Filing Dt:
|
06/16/2003
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
Title:
|
METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2007
|
Application #:
|
10465443
|
Filing Dt:
|
06/19/2003
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
Title:
|
METHOD AND APPARATUS FOR FORMATTING SIGNALS FOR DIGITAL AUDIO BROADCASTING TRANSMISSION AND RECEPTION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2012
|
Application #:
|
10471608
|
Filing Dt:
|
03/19/2004
|
Publication #:
|
|
Pub Dt:
|
08/19/2004
| | | | |
Title:
|
Information delivery system for generating a data stream with a server system based on a content file received from a client device
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
10474863
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10482012
|
Filing Dt:
|
12/23/2003
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2013
|
Application #:
|
10484518
|
Filing Dt:
|
12/02/2004
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
Title:
|
SYSTEM AND METHOD FOR TRANSMITTING DIGITAL MULTIMEDIA DATA WITH ANALOG BROADCAST DATA
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2009
|
Application #:
|
10487482
|
Filing Dt:
|
09/17/2004
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
Title:
|
STACKED CHIP ASSEMBLY WITH ENCAPSULANT LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2009
|
Application #:
|
10488210
|
Filing Dt:
|
10/13/2004
|
Publication #:
|
|
Pub Dt:
|
03/03/2005
| | | | |
Title:
|
HIGH-FREQUENCY CHIP PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10516647
|
Filing Dt:
|
12/01/2004
|
Publication #:
|
|
Pub Dt:
|
08/11/2005
| | | | |
Title:
|
QUAD FLAT NON-LEADED PACKAGE COMPRISING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2008
|
Application #:
|
10525804
|
Filing Dt:
|
02/25/2005
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
Title:
|
VERSION-PROGRAMMABLE CIRCUIT MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
10534165
|
Filing Dt:
|
05/05/2005
|
Publication #:
|
|
Pub Dt:
|
07/20/2006
| | | | |
Title:
|
DATA CARRIER WITH A MODULE WITH A REINFORCEMENT STRIP
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/2009
|
Application #:
|
10538281
|
Filing Dt:
|
06/10/2005
|
Publication #:
|
|
Pub Dt:
|
01/26/2006
| | | | |
Title:
|
WIREBONDING METHOD AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
10538378
|
Filing Dt:
|
06/13/2005
|
Publication #:
|
|
Pub Dt:
|
05/25/2006
| | | | |
Title:
|
COARSE DELAY TUNER CIRCUITS WITH EDGE SUPPRESSORS IN DELAY LOCKED LOOPS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
10541967
|
Filing Dt:
|
06/23/2006
|
Publication #:
|
|
Pub Dt:
|
11/16/2006
| | | | |
Title:
|
CAMERA WITH IMAGE ENHANCEMENT FUNCTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2010
|
Application #:
|
10555755
|
Filing Dt:
|
04/28/2008
|
Publication #:
|
|
Pub Dt:
|
08/21/2008
| | | | |
Title:
|
METHOD AND ARRANGEMENT FOR SETTING THE TRANSMISSION OF A MOBILE COMMUNICATION DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2016
|
Application #:
|
10560717
|
Filing Dt:
|
12/15/2005
|
Publication #:
|
|
Pub Dt:
|
06/22/2006
| | | | |
Title:
|
ELECTRONIC DEVICE, ASSEMBLY AND METHODS OF MANUFACTURING AN ELECTRONIC DEVICE INCLUDING A VERTICAL TRENCH CAPACITOR AND A VERTICAL INTERCONNECT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2008
|
Application #:
|
10566552
|
Filing Dt:
|
01/27/2006
|
Publication #:
|
|
Pub Dt:
|
08/24/2006
| | | | |
Title:
|
INTERGRATED CIRCUIT WITH DYNAMIC COMMUNICATION SERVICE SELECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2009
|
Application #:
|
10570446
|
Filing Dt:
|
03/02/2006
|
Publication #:
|
|
Pub Dt:
|
01/25/2007
| | | | |
Title:
|
METHOD OF ACQUIRING A RECEIVED SPREAD SPECTRUM SIGNAL
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2009
|
Application #:
|
10575581
|
Filing Dt:
|
04/11/2006
|
Publication #:
|
|
Pub Dt:
|
03/08/2007
| | | | |
Title:
|
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2009
|
Application #:
|
10575773
|
Filing Dt:
|
04/12/2006
|
Publication #:
|
|
Pub Dt:
|
02/08/2007
| | | | |
Title:
|
TIME BASE ADJUSTMENT IN A DATA PROCESSING DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2008
|
Application #:
|
10576570
|
Filing Dt:
|
04/19/2006
|
Publication #:
|
|
Pub Dt:
|
06/28/2007
| | | | |
Title:
|
METHOD AND SYSTEM FOR POWERING AN INTEGRATED CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2007
|
Application #:
|
10607274
|
Filing Dt:
|
06/27/2003
|
Publication #:
|
|
Pub Dt:
|
02/26/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2005
|
Application #:
|
10607289
|
Filing Dt:
|
06/26/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHODS OF MAKING MICROELECTRONIC PACKAGES INCLUDING ELECTRICALLY AND/OR THERMALLY CONDUCTIVE ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2006
|
Application #:
|
10608295
|
Filing Dt:
|
06/24/2003
|
Publication #:
|
|
Pub Dt:
|
03/18/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2005
|
Application #:
|
10611390
|
Filing Dt:
|
07/01/2003
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
Title:
|
ASSEMBLIES HAVING STACKED SEMICONDUCTOR CHIPS AND METHODS OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10614069
|
Filing Dt:
|
07/03/2003
|
Publication #:
|
|
Pub Dt:
|
03/04/2004
| | | | |
Title:
|
METHOD OF MAKING A MICROELECTRONIC ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2006
|
Application #:
|
10614642
|
Filing Dt:
|
07/07/2003
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
Title:
|
METHOD AND SYSTEM OF TESTING DATA RETENTION OF MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10616981
|
Filing Dt:
|
07/11/2003
|
Publication #:
|
|
Pub Dt:
|
01/29/2004
| | | | |
Title:
|
SEMICONDUCTOR CHIP, WIRING BOARD AND MANUFACTURING PROCESS THEREOF AS WELL AS SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2006
|
Application #:
|
10623849
|
Filing Dt:
|
07/22/2003
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10625616
|
Filing Dt:
|
07/24/2003
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE INCLUDING N-CHANNEL FETS AND P-CHANNEL FETS WITH IMPROVED DRAIN CURRENT CHARACTERISTICS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10626366
|
Filing Dt:
|
07/23/2003
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD FOR A PBGA PACKAGE HAVING A MULTIPLICITY OF STAGGERED POWER RING SEGMENTS FOR POWER CONNECTION TO INTEGRATED CIRCUIT DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
10627057
|
Filing Dt:
|
07/25/2003
|
Publication #:
|
|
Pub Dt:
|
04/08/2004
| | | | |
Title:
|
RF SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10639086
|
Filing Dt:
|
08/12/2003
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
Title:
|
STRUCTURE AND METHOD OF MAKING AN ENHANCED SURFACE AREA CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10640177
|
Filing Dt:
|
08/13/2003
|
Publication #:
|
|
Pub Dt:
|
06/03/2004
| | | | |
Title:
|
MICROELECTRONIC PACKAGES WITH SELF-ALIGNING FEATURES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10643701
|
Filing Dt:
|
08/19/2003
|
Publication #:
|
|
Pub Dt:
|
09/02/2004
| | | | |
Title:
|
COMPLIANT PACKAGE WITH CONDUCTIVE ELASTOMERIC POSTS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2006
|
Application #:
|
10649741
|
Filing Dt:
|
08/28/2003
|
Publication #:
|
|
Pub Dt:
|
07/01/2004
| | | | |
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
10654375
|
Filing Dt:
|
09/03/2003
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
METHODS OF MAKING MICROELECTRONIC PACKAGES INCLUDING FOLDED SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2006
|
Application #:
|
10655952
|
Filing Dt:
|
09/05/2003
|
Publication #:
|
|
Pub Dt:
|
05/27/2004
| | | | |
Title:
|
ASSEMBLIES HAVING STACKED SEMICONDUCTOR CHIPS AND METHODS OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2007
|
Application #:
|
10656534
|
Filing Dt:
|
09/05/2003
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
COMPONENTS, METHODS AND ASSEMBLIES FOR STACKED PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2005
|
Application #:
|
10658177
|
Filing Dt:
|
09/09/2003
|
Publication #:
|
|
Pub Dt:
|
03/11/2004
| | | | |
Title:
|
LOW COST AND COMPLIANT MICROELECTRONIC PACKAGES FOR HIGH I/O AND FINE PITCH
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2005
|
Application #:
|
10658941
|
Filing Dt:
|
09/10/2003
|
Publication #:
|
|
Pub Dt:
|
03/11/2004
| | | | |
Title:
|
A METHOD FOR MAKING A MICROELECTRONIC INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2005
|
Application #:
|
10665148
|
Filing Dt:
|
09/22/2003
|
Publication #:
|
|
Pub Dt:
|
03/18/2004
| | | | |
Title:
|
ETCHING AND CLEANING METHODS AND ETCHING AND CLEANING APPARATUSES USED THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10666775
|
Filing Dt:
|
09/18/2003
|
Publication #:
|
|
Pub Dt:
|
03/24/2005
| | | | |
Title:
|
I/C CHIP SUITABLE FOR WIRE BONDING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2008
|
Application #:
|
10672441
|
Filing Dt:
|
09/26/2003
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
METHOD AND APPARATUS FOR INTERLEAVING SIGNAL BITS IN A DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2009
|
Application #:
|
10677604
|
Filing Dt:
|
10/02/2003
|
Publication #:
|
|
Pub Dt:
|
04/07/2005
| | | | |
Title:
|
METHOD OF FORMING LOW WIRE LOOPS AND WIRE LOOPS FORMED USING THE METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10681718
|
Filing Dt:
|
10/08/2003
|
Publication #:
|
|
Pub Dt:
|
04/14/2005
| | | | |
Title:
|
HEARING AJUSTMENT APPLIANCE FOR ELECTRONIC AUDIO EQUIPMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10683097
|
Filing Dt:
|
10/10/2003
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
Title:
|
COMPONENTS, METHODS AND ASSEMBLIES FOR MULTI-CHIP PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/26/2005
|
Application #:
|
10685361
|
Filing Dt:
|
10/14/2003
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
Title:
|
SEMICONDUCTOR CHIP PACKAGE WITH INTERCONNECT STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10688910
|
Filing Dt:
|
10/21/2003
|
Title:
|
SINGLE MASK VIA METHOD AND DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10689642
|
Filing Dt:
|
10/22/2003
|
Publication #:
|
|
Pub Dt:
|
04/29/2004
| | | | |
Title:
|
LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2006
|
Application #:
|
10699328
|
Filing Dt:
|
10/31/2003
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
Title:
|
MICROELECTRONIC ASSEMBLIES HAVING LOW PROFILE CONNECTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2006
|
Application #:
|
10707293
|
Filing Dt:
|
12/03/2003
|
Publication #:
|
|
Pub Dt:
|
10/28/2004
| | | | |
Title:
|
METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10708649
|
Filing Dt:
|
03/17/2004
|
Publication #:
|
|
Pub Dt:
|
09/22/2005
| | | | |
Title:
|
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS OF SEED LAYER UNDERETCHING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2007
|
Application #:
|
10715582
|
Filing Dt:
|
11/18/2003
|
Publication #:
|
|
Pub Dt:
|
05/19/2005
| | | | |
Title:
|
COHERENT TRACKING FOR FM IN-BAND ON-CHANNEL RECEIVERS
|
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10717342
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Filing Dt:
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11/18/2003
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING BYPASS CAPACITORS COUPLED TO BOTTOM OF PACKAGE SUBSTRATE AND SUPPORTING SURFACE MOUNTING TECHNOLOGY
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10718515
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Filing Dt:
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11/24/2003
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Publication #:
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Pub Dt:
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05/27/2004
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Title:
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MASTER SLICE SEMICONDUCTOR INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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09/12/2006
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Application #:
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10720958
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Filing Dt:
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11/24/2003
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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ROUTING SCHEME FOR DIFFERENTIAL PAIRS IN FLIP CHIP SUBSTRATES
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10724258
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Filing Dt:
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12/01/2003
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Publication #:
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Pub Dt:
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06/10/2004
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Title:
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CCD IMAGE SENSOR
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10728306
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Filing Dt:
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12/04/2003
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Publication #:
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Pub Dt:
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04/29/2004
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Title:
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METHOD OF MAKING A MICROELECTRONIC PACKAGE
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Patent #:
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Issue Dt:
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08/02/2005
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Application #:
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10729174
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Filing Dt:
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12/05/2003
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Publication #:
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Pub Dt:
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07/08/2004
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Title:
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METHOD OF FORMING FILLED BLIND VIAS
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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10734776
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Filing Dt:
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12/12/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Title:
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SYSTEMS AND METHODS OF SPATIAL IMAGE ENHANCEMENT OF A SOUND SOURCE
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10739319
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Filing Dt:
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12/19/2003
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Publication #:
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Pub Dt:
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07/08/2004
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Title:
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SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10739707
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Filing Dt:
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12/17/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10739788
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Filing Dt:
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12/17/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
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Patent #:
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Issue Dt:
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06/27/2006
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Application #:
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10743651
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Filing Dt:
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12/22/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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ELECTROSTATIC DISCHARGE DEVICE
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10743783
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Filing Dt:
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12/24/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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10746810
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Filing Dt:
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12/24/2003
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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HIGH FREQUENCY CHIP PACKAGES WITH CONNECTING ELEMENTS
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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10747982
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Filing Dt:
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12/31/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10756121
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Filing Dt:
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01/12/2004
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Publication #:
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Pub Dt:
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07/29/2004
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Title:
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SEMICONDUCTOR DEVICE WITH FOLDED FILM SUBSTRATE AND DISPLAY DEVICE USING THE SAME
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Patent #:
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Issue Dt:
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09/12/2006
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Application #:
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10756631
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Filing Dt:
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01/12/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
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Patent #:
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Issue Dt:
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02/26/2008
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Application #:
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10762318
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Filing Dt:
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01/23/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
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Patent #:
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Issue Dt:
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03/04/2008
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Application #:
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10764629
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Filing Dt:
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01/26/2004
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Publication #:
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Pub Dt:
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07/28/2005
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Title:
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FORWARD ERROR CORRECTION CODING FOR HYBRID AM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEMS
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10766892
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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06/02/2009
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Application #:
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10770314
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Filing Dt:
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02/02/2004
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Publication #:
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Pub Dt:
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08/04/2005
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Title:
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PEAK-TO-AVERAGE POWER REDUCTION FOR FM OFDM TRANSMISSION
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Patent #:
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Issue Dt:
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12/18/2007
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Application #:
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10771252
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Filing Dt:
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02/03/2004
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Publication #:
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Pub Dt:
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11/11/2004
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Title:
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METHOD FOR MAKING A MICROELECTRONIC PACKAGE USING PRE-PATTERNED, REUSABLE MOLD AND METHOD FOR MAKING THE MOLD
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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10771728
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Filing Dt:
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02/04/2004
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD AND PACKAGING STRUCTURE FOR OPTIMIZING WARPAGE OF FLIP CHIP ORGANIC PACKAGES
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10777804
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Filing Dt:
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02/12/2004
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Publication #:
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Pub Dt:
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08/19/2004
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Title:
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ASSEMBLIES FOR TEMPORARILY CONNECTING MICROELECTRONIC ELEMENTS FOR TESTING AND METHODS THEREFOR
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Patent #:
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Issue Dt:
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09/11/2007
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Application #:
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10783314
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Filing Dt:
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02/20/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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HIGH-FREQUENCY CHIP PACKAGES
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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10786825
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Filing Dt:
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02/25/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Title:
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MANUFACTURE OF MOUNTABLE CAPPED CHIPS
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10787437
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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METHOD OF MANUFACTURING A DUAL GATE SEMICONDUCTOR DEVICE WITH A POLY-METAL ELECTRODE
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10787740
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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09/30/2004
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Title:
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FABRICATION METHOD OF SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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10792757
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Filing Dt:
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03/05/2004
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Publication #:
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Pub Dt:
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09/08/2005
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Title:
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WAFER SCALE DIE HANDLING
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Patent #:
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Issue Dt:
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05/08/2007
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Application #:
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10798053
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Filing Dt:
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03/11/2004
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Publication #:
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Pub Dt:
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09/15/2005
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Title:
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METHOD OF FABRICATING A WIRE BOND WITH MULTIPLE STITCH BONDS
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10798540
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Filing Dt:
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03/10/2004
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
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Patent #:
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Issue Dt:
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09/20/2005
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Application #:
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10801764
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Filing Dt:
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03/16/2004
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Publication #:
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Pub Dt:
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09/09/2004
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Title:
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METHOD TO REDUCE NUMBER OF WIRE-BOND LOOP HEIGHTS VERSUS THE TOTAL QUANTITY OF POWER AND SIGNAL RINGS
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10817820
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Filing Dt:
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04/06/2004
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Publication #:
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Pub Dt:
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09/30/2004
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT AND NONVOLATILE MEMORY ELEMENT
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10823611
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Filing Dt:
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04/14/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Title:
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MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10825436
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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10/07/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
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Patent #:
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Issue Dt:
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01/23/2007
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Application #:
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10827860
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Filing Dt:
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04/20/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Title:
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METHODS FOR MANUFACTURING RESISTORS USING A SACRIFICIAL LAYER
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Patent #:
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Issue Dt:
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07/05/2005
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Application #:
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10834342
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Filing Dt:
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04/28/2004
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Publication #:
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Pub Dt:
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10/14/2004
| | | | |
Title:
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STACKED PACKAGES
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Patent #:
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Issue Dt:
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05/02/2006
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Application #:
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10843137
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Filing Dt:
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05/11/2004
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Publication #:
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Pub Dt:
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10/21/2004
| | | | |
Title:
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METHOD FOR FORMING A MULTI-LAYER CIRCUIT ASSEMBLY
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10851350
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Filing Dt:
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05/24/2004
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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NON-VOLATILE SEMICONDUCTOR MEMORY AND METHOD OF MAKING SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MAKING DEVICE
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Patent #:
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Issue Dt:
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02/19/2008
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Application #:
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10856723
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Filing Dt:
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05/28/2004
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Publication #:
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Pub Dt:
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11/04/2004
| | | | |
Title:
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SELECTIVE REMOVAL OF DIELECTRIC MATERIALS AND PLATING PROCESS USING SAME
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10866701
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Filing Dt:
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06/15/2004
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Publication #:
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Pub Dt:
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11/11/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
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Patent #:
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Issue Dt:
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07/11/2006
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Application #:
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10872501
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Filing Dt:
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06/22/2004
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Publication #:
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Pub Dt:
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11/18/2004
| | | | |
Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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