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Reel/Frame:052940/0915   Pages: 14
Recorded: 06/15/2020
Attorney Dkt #:T0509.70048US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/31/2022
Application #:
16766259
Filing Dt:
05/21/2020
Publication #:
Pub Dt:
12/03/2020
Title:
SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
Assignors
1
Exec Dt:
05/25/2020
2
Exec Dt:
05/25/2020
3
Exec Dt:
05/25/2020
4
Exec Dt:
05/25/2020
5
Exec Dt:
05/25/2020
6
Exec Dt:
05/25/2020
7
Exec Dt:
05/25/2020
8
Exec Dt:
05/25/2020
9
Exec Dt:
05/25/2020
10
Exec Dt:
05/25/2020
Assignee
1
23, SENJU-HASHIDO-CHO
ADACHI-KU, TOKYO, JAPAN 1208555
Correspondence name and address
WOLF GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210

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