Patent Assignment Details
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| Reel/Frame: | 053029/0754 | |
| Pages: | 10 |
| | Recorded: | 06/24/2020 | | |
| Attorney Dkt #: | 434620-000269 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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16957537
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Filing Dt:
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06/24/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Title:
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FLUX AND SOLDER PASTE
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Assignee
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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NIXON PEABODY, LLP
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799 NINTH STREET, NW
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SUITE 500
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WASHINGTON, DC 20001-4501
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05/02/2024 04:07 PM
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