Patent Assignment Details
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| Reel/Frame: | 053033/0442 | |
| Pages: | 3 |
| | Recorded: | 06/24/2020 | | |
| Attorney Dkt #: | FIP-48456 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16957592
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Filing Dt:
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06/24/2020
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Publication #:
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Pub Dt:
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11/05/2020
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Title:
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RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
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Assignee
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| 3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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Correspondence name and address
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RANKIN, HILL & CLARK LLP
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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05/01/2024 03:07 AM
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