Patent Assignment Details
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| Reel/Frame: | 053131/0659 | |
| Pages: | 14 |
| | Recorded: | 07/06/2020 | | |
| Attorney Dkt #: | 0190/0203PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/2021
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Application #:
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16906693
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Filing Dt:
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06/19/2020
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Publication #:
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Pub Dt:
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02/18/2021
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Title:
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HEAT DISSIPATION PLATE ASSEMBLY, DISPLAY MODULE AND ITS ASSEMBLING METHOD
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Assignees
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| NO. 1188 HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE |
| CHENGDU, SICHUAN, CHINA 611731 |
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| NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT |
| BEIJING, CHINA 100015 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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