Patent Assignment Details
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| Reel/Frame: | 053249/0941 | |
| Pages: | 13 |
| | Recorded: | 07/20/2020 | | |
| Attorney Dkt #: | 3531.141996R |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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16895186
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Filing Dt:
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06/08/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Title:
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WAFER PROCESSING METHOD INCLUDING UNITING A WAFER, A RING FRAME AND A POLYESTER SHEET WITHOUT USING AN ADHESIVE LAYER
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Assignee
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU, |
| TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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GREER, BURNS & CRAIN, LTD
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300 S. WACKER DR.
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SUITE 2500
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CHICAGO, IL 60606
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