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Reel/Frame:053334/0318   Pages: 3
Recorded: 07/28/2020
Attorney Dkt #:1314/297A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/19/2022
Application #:
16941486
Filing Dt:
07/28/2020
Publication #:
Pub Dt:
02/04/2021
Title:
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
07/27/2020
2
Exec Dt:
07/27/2020
Assignee
1
9F., NO. 23, JILIN RD.
ZHONGLI DIST.
TAOYUAN CITY, TAIWAN 320
Correspondence name and address
WEN LIU
350 S. FIGUEROA STREET, SUITE 975
LOS ANGELES, CA 90071

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