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Reel/Frame:053459/0356   Pages: 5
Recorded: 08/11/2020
Attorney Dkt #:2019-4242/24061.4143US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/13/2022
Application #:
16888217
Filing Dt:
05/29/2020
Publication #:
Pub Dt:
12/02/2021
Title:
Semiconductor Devices with Backside Air Gap Dielectric
Assignors
1
Exec Dt:
06/02/2020
2
Exec Dt:
06/02/2020
3
Exec Dt:
06/02/2020
4
Exec Dt:
06/02/2020
5
Exec Dt:
06/02/2020
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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