Patent Assignment Details
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| Reel/Frame: | 053466/0627 | |
| Pages: | 6 |
| | Recorded: | 08/12/2020 | | |
| Attorney Dkt #: | 050083-0603 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/2022
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Application #:
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16958633
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Filing Dt:
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06/26/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignees
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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04/29/2024 01:59 PM
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